Ju Hee Yang

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 11,502,051
- Issue date Nov 15, 2022
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes, semiconductor pack...
- Patent number 9,129,963
- Issue date Sep 8, 2015
- SK Hynix Inc.
- Ju Heon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for femtosecond laser optically pumped by laser diode pum...
- Patent number 8,989,224
- Issue date Mar 24, 2015
- Korea Electrotechnology Research Institute
- Guang Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Femtosecond laser apparatus and femtosecond laser system including...
- Patent number 8,891,564
- Issue date Nov 18, 2014
- Korea Electrotechnology Research Institute
- Guang Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and stack package having the same
- Patent number 8,829,665
- Issue date Sep 9, 2014
- SK Hynix Inc.
- Ju Heon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Femtosecond laser apparatus using laser diode optical pumping module
- Patent number 8,594,141
- Issue date Nov 26, 2013
- Korea Electrotechnology Research Institute
- Guang Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser apparatus using anisotropic crystals
- Patent number 8,582,613
- Issue date Nov 12, 2013
- Korea Electrotechnology Research Institute
- Guang Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105656
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS WITH DIFFERENT WIDTHS A...
- Publication number 20230298937
- Publication date Sep 21, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
- Publication number 20220084968
- Publication date Mar 17, 2022
- SK HYNIX INC.
- Ho Young SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20140015126
- Publication date Jan 16, 2014
- SK HYNIX INC.
- Ju Heon YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEMTOSECOND LASER APPARATUS AND FEMTOSECOND LASER SYSTEM INCLUDING...
- Publication number 20130336345
- Publication date Dec 19, 2013
- Korea Electrotechnology Research Institute
- Guang Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR FEMTOSECOND LASER OPTICALLY PUMPED BY LASER DIODE PUM...
- Publication number 20130223470
- Publication date Aug 29, 2013
- Korea Electrotechnology Research Institute
- Guang Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEMTOSECOND LASER APPARATUS USING LASER DIODE OPTICAL PUMPING MODULE
- Publication number 20130051411
- Publication date Feb 28, 2013
- KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE
- Guang Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND STACK PACKAGE HAVING THE SAME
- Publication number 20120007253
- Publication date Jan 12, 2012
- Hynix Semiconductor Inc.
- Ju Heon YANG
- H01 - BASIC ELECTRIC ELEMENTS

Ju Hee Yang

Person

Patents Grantslast 30 patents

Semiconductor chip including through electrode, and semiconductor p...

Semiconductor devices having through electrodes, semiconductor pack...

Apparatus for femtosecond laser optically pumped by laser diode pum...

Femtosecond laser apparatus and femtosecond laser system including...

Semiconductor chip and stack package having the same

Femtosecond laser apparatus using laser diode optical pumping module

Laser apparatus using anisotropic crystals

Patents Applicationslast 30 patents

PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS WITH DIFFERENT WIDTHS A...

SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE USING THE SAME

FEMTOSECOND LASER APPARATUS AND FEMTOSECOND LASER SYSTEM INCLUDING...

APPARATUS FOR FEMTOSECOND LASER OPTICALLY PUMPED BY LASER DIODE PUM...

FEMTOSECOND LASER APPARATUS USING LASER DIODE OPTICAL PUMPING MODULE

SEMICONDUCTOR CHIP AND STACK PACKAGE HAVING THE SAME