Ju Il EOM

Person

Guri-si Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip including chip pads of different surface areas,...
- Patent number 12,021,515
- Issue date Jun 25, 2024
- SK hynix Inc.
- Ju Il Eom
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package and semiconductor module including the same
- Patent number 12,015,015
- Issue date Jun 18, 2024
- SK hynix Inc.
- Byung Jun Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,742,340
- Issue date Aug 29, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an interposer
- Patent number 11,682,627
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having chip pads of different surface areas, and...
- Patent number 11,682,643
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor module including the same
- Patent number 11,605,615
- Issue date Mar 14, 2023
- SK hynix Inc.
- Byung Jun Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,462,511
- Issue date Oct 4, 2022
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,309,303
- Issue date Apr 19, 2022
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including capacitor
- Patent number 11,270,958
- Issue date Mar 8, 2022
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,985,099
- Issue date Apr 20, 2021
- SK hynix Inc.
- Jae Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,741,529
- Issue date Aug 11, 2020
- SK HYNIX, INC.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,224,314
- Issue date Mar 5, 2019
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a redistribution line structure
- Patent number 10,115,708
- Issue date Oct 30, 2018
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphic user interface device and method of displaying graphic objects
- Patent number 9,395,906
- Issue date Jul 19, 2016
- Korea Institute of Science and Technology
- Seung Soo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package substrate with band stop filter and semiconductor package i...
- Patent number 9,231,286
- Issue date Jan 5, 2016
- SK Hynix Inc.
- Byung Jun Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent computing device agent system for automatic recognition...
- Patent number 8,190,658
- Issue date May 29, 2012
- Korea Institute of Science and Technology
- Ki Won Yeom
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE INCLUDING A REFERENCE VOLTAGE LAYER HAVING AN IMPEDANCE C...
- Publication number 20240196515
- Publication date Jun 13, 2024
- SK HYNIX INC.
- Jae Hoon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20240021596
- Publication date Jan 18, 2024
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
- Publication number 20230197687
- Publication date Jun 22, 2023
- SK HYNIX INC.
- Byung Jun BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE INCLUDING THE SAME
- Publication number 20220336420
- Publication date Oct 20, 2022
- SK HYNIX INC.
- Byung Jun BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING CHIP PADS OF DIFFERENT SURFACE AREAS,...
- Publication number 20220173735
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...
- Publication number 20220173061
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220037304
- Publication date Feb 3, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220028847
- Publication date Jan 27, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220013499
- Publication date Jan 13, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR
- Publication number 20210366847
- Publication date Nov 25, 2021
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER
- Publication number 20210167017
- Publication date Jun 3, 2021
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER
- Publication number 20200402959
- Publication date Dec 24, 2020
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20200176407
- Publication date Jun 4, 2020
- SK HYNIX INC.
- Jae Hoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20190139940
- Publication date May 9, 2019
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A REDISTRIBUTION LINE STRUCTURE
- Publication number 20180138150
- Publication date May 17, 2018
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20170309600
- Publication date Oct 26, 2017
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH BAND STOP FILTER AND SEMICONDUCTOR PACKAGE I...
- Publication number 20140176262
- Publication date Jun 26, 2014
- Byung Jun BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR MULTIFUNCTIONAL POWER CONVERSION EMPLOYING A...
- Publication number 20130234521
- Publication date Sep 12, 2013
- IN-TECH FACTORY AUTOMATION CO., LTD
- Ju Kyoung Eom
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Intelligent Computing Device Agent System For Automatic Recognition...
- Publication number 20090083234
- Publication date Mar 26, 2009
- Korea Institute of Science and Technology
- Ki Won Yeom
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
GRAPHIC USER INTERFACE DEVICE AND METHOD OF DISPLAYING GRAPHIC OBJECTS
- Publication number 20090040179
- Publication date Feb 12, 2009
- Seung Soo LEE
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Semiconductor chip including chip pads of different surface areas,...

Semiconductor package and semiconductor module including the same

Semiconductor package including stacked semiconductor chips

Semiconductor package including an interposer

Semiconductor chip having chip pads of different surface areas, and...

Semiconductor package and semiconductor module including the same

Semiconductor package including stacked semiconductor chips

Semiconductor package including stacked semiconductor chips

Semiconductor package including capacitor

Semiconductor packages

Semiconductor packages

Semiconductor packages

Semiconductor package having a redistribution line structure

Graphic user interface device and method of displaying graphic objects

Package substrate with band stop filter and semiconductor package i...

Intelligent computing device agent system for automatic recognition...

Patents Applicationslast 30 patents

SUBSTRATE INCLUDING A REFERENCE VOLTAGE LAYER HAVING AN IMPEDANCE C...

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE INCLUDING THE SAME

SEMICONDUCTOR CHIP INCLUDING CHIP PADS OF DIFFERENT SURFACE AREAS,...

SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER

STACKED SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE HAVING A REDISTRIBUTION LINE STRUCTURE

SEMICONDUCTOR PACKAGES

PACKAGE SUBSTRATE WITH BAND STOP FILTER AND SEMICONDUCTOR PACKAGE I...

METHOD AND DEVICE FOR MULTIFUNCTIONAL POWER CONVERSION EMPLOYING A...

Intelligent Computing Device Agent System For Automatic Recognition...

GRAPHIC USER INTERFACE DEVICE AND METHOD OF DISPLAYING GRAPHIC OBJECTS