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Juan G. Milla
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Mesa, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Stacked die package
Patent number
7,045,390
Issue date
May 16, 2006
Medtronic, Inc.
Juan G. Milla
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming a high-voltage/high-power die package
Patent number
6,991,961
Issue date
Jan 31, 2006
Medtronic, Inc.
Robert L. Hubbard
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Implantable medical device including a surface-mount terminal array
Patent number
6,963,780
Issue date
Nov 8, 2005
Medtronic, Inc.
David A. Ruben
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
High voltage flip-chip component package and method for forming the...
Patent number
6,836,022
Issue date
Dec 28, 2004
Medtronic, Inc.
Mark R. Boone
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming a die package
Patent number
6,696,318
Issue date
Feb 24, 2004
Medtronic, Inc.
Juan G. Milla
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for forming a die package
Patent number
6,670,217
Issue date
Dec 30, 2003
Medtronic, Inc.
Juan G. Milla
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Implantable medical electronics using high voltage flip chip compon...
Patent number
6,626,931
Issue date
Sep 30, 2003
Medtronic, Inc.
Juan G. Milla
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Method of making encapsulated package
Patent number
6,057,175
Issue date
May 2, 2000
Medtronic, Inc.
Juan G. Milla
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Grant
Packaged integrated accelerometer
Patent number
5,674,258
Issue date
Oct 7, 1997
Medtronic, Inc.
Mark E. Henschel
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Patents Applications
last 30 patents
Information
Patent Application
Method for forming a high-voltage/high-power die package
Publication number
20040259289
Publication date
Dec 23, 2004
Medtronic, Inc.
Robert L. Hubbard
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High voltage flip-chip component package and method for forming the...
Publication number
20040159956
Publication date
Aug 19, 2004
Mark R. Boone
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked die package
Publication number
20030180987
Publication date
Sep 25, 2003
Medtronic, Inc.
Juan G. Milla
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Implantable medical device including a surface-mount terminal array
Publication number
20030144707
Publication date
Jul 31, 2003
David A. Ruben
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
Methods for forming a die package
Publication number
20020127837
Publication date
Sep 12, 2002
Medtronic, Inc.
Juan G. Milla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods for forming a die package
Publication number
20020123172
Publication date
Sep 5, 2002
Medtronic, Inc.
Juan G. Milla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked die package
Publication number
20020121693
Publication date
Sep 5, 2002
Juan G. Milla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Implantable medical electronics using high voltage flip chip compon...
Publication number
20020082643
Publication date
Jun 27, 2002
Juan G. Milla
H01 - BASIC ELECTRIC ELEMENTS