Judy H. Huang

Person

Los Gatos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inductive/capacitive hybrid plasma source and system with such chamber
- Patent number 9,034,143
- Issue date May 19, 2015
- Intevac, Inc.
- Young Kyu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable film dielectric gap fill process
- Patent number 8,809,161
- Issue date Aug 19, 2014
- Novellus Systems, Inc.
- Vishal Gauri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for masking solar cell substrates for deposition
- Patent number 8,677,929
- Issue date Mar 25, 2014
- Intevac, Inc.
- Alexander J. Berger
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
CVD flowable gap fill
- Patent number 8,580,697
- Issue date Nov 12, 2013
- Novellus Systems, Inc.
- Chi-I Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable film dielectric gap fill process
- Patent number 8,481,403
- Issue date Jul 9, 2013
- Novellus Systems, Inc.
- Vishal Gauri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having silicon carbide and conductive pathway...
- Patent number 8,183,150
- Issue date May 22, 2012
- Applied Materials, Inc.
- Judy H. Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CVD flowable gap fill
- Patent number 7,915,139
- Issue date Mar 29, 2011
- Novellus Systems, Inc.
- Chi-I Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable film dielectric gap fill process
- Patent number 7,888,233
- Issue date Feb 15, 2011
- Novellus Systems, Inc.
- Vishal Gauri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
H2-based plasma treatment to eliminate within-batch and batch-to-ba...
- Patent number 7,727,906
- Issue date Jun 1, 2010
- Novellus Systems, Inc.
- Sunil Shanker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ deposition of a low κ dielectric layer, barrier layer, etch...
- Patent number 7,670,945
- Issue date Mar 2, 2010
- Applied Materials, Inc.
- Judy H. Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CVD flowable gap fill
- Patent number 7,582,555
- Issue date Sep 1, 2009
- Novellus Systems, Inc.
- Chi-I Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flowable film dielectric gap fill process
- Patent number 7,524,735
- Issue date Apr 28, 2009
- Novellus Systems, Inc.
- Vishal Gauri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stress profile modulation in STI gap fill
- Patent number 7,482,245
- Issue date Jan 27, 2009
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Halogen-free noble gas assisted H2 plasma etch process in depositio...
- Patent number 7,476,621
- Issue date Jan 13, 2009
- Novellus Systems, Inc.
- Minh Anh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ deposition of a low K dielectric layer, barrier layer, etch...
- Patent number 7,470,611
- Issue date Dec 30, 2008
- Applied Materials, Inc.
- Judy H. Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Helium-based etch process in deposition-etch-deposition gap fill
- Patent number 7,344,996
- Issue date Mar 18, 2008
- Novellus Systems, Inc.
- Chi-I Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated low k dielectrics and etch stops
- Patent number 7,227,244
- Issue date Jun 5, 2007
- Applied Materials, Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hydrogen treatment enhanced gap fill
- Patent number 7,211,525
- Issue date May 1, 2007
- Novellus Systems, Inc.
- Sunil Shanker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treatment to enhance adhesion and to minimize oxidation of c...
- Patent number 7,144,606
- Issue date Dec 5, 2006
- Applied Materials, Inc.
- Judy Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for depositing antireflective coating
- Patent number 7,070,657
- Issue date Jul 4, 2006
- Applied Materials Inc.
- David Cheung
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
In situ deposition of a low κ dielectric layer, barrier layer, etch...
- Patent number 6,974,766
- Issue date Dec 13, 2005
- Applied Materials, Inc.
- Judy H. Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon carbide deposition for use as a low dielectric constant ant...
- Patent number 6,951,826
- Issue date Oct 4, 2005
- Applied Materials, Inc.
- Christopher Bencher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treatment for copper oxide reduction
- Patent number 6,946,401
- Issue date Sep 20, 2005
- Applied Materials, Inc.
- Judy H. Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated low K dielectrics and etch stops
- Patent number 6,858,153
- Issue date Feb 22, 2005
- Applied Materials Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Binder-enriched silicalite adhesion layer and apparatus for fabrica...
- Patent number 6,827,982
- Issue date Dec 7, 2004
- Novellus Systems, Inc.
- Judy Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treatment to enhance adhesion and to minimize oxidation of c...
- Patent number 6,821,571
- Issue date Nov 23, 2004
- Applied Materials Inc.
- Judy Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for treating low k dielectric layers to reduce...
- Patent number 6,794,311
- Issue date Sep 21, 2004
- Applied Materials Inc.
- Kegang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hermetic silicon carbide
- Patent number 6,777,349
- Issue date Aug 17, 2004
- Novellus Systems, Inc.
- Haiying Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma treatment for copper oxide reduction
- Patent number 6,734,102
- Issue date May 11, 2004
- Applied Materials Inc.
- Sudha Rathi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having reduced oxidation interface
- Patent number 6,700,202
- Issue date Mar 2, 2004
- Applied Materials, Inc.
- Judy H. Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FLOWABLE FILM DIELECTRIC GAP FILL PROCESS
- Publication number 20140017904
- Publication date Jan 16, 2014
- Vishal GAURI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INDUCTIVE/CAPACITIVE HYBRID PLASMA SOURCE AND SYSTEM WITH SUCH CHAMBER
- Publication number 20130087531
- Publication date Apr 11, 2013
- INTEVAC, INC.
- Young Kyu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REAR POINT CONTACT FABRICATION FOR SOLAR CELLS
- Publication number 20120295394
- Publication date Nov 22, 2012
- Young Kyu Cho
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD AND APPARATUS FOR MASKING SUBSTRATES FOR DEPOSITION
- Publication number 20120171807
- Publication date Jul 5, 2012
- Alexander J. BERGER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR CHAMBER CLEANING BY IN-SITU PLASMA EXCITATION
- Publication number 20090159104
- Publication date Jun 25, 2009
- Judy Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN SITU DEPOSITION OF A LOW K DIELECTRIC LAYER, BARRIER LAYER, ETCH...
- Publication number 20090130837
- Publication date May 21, 2009
- APPLIED MATERIALS, INC.
- Judy H. Huang
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SILICON CARBIDE AND CONDUCTIVE PATHWAY...
- Publication number 20090050902
- Publication date Feb 26, 2009
- Judy H. Huang
- B08 - CLEANING
Information Patent Application
In situ deposition of a low K dielectric layer, barrier layer, etch...
- Publication number 20060089007
- Publication date Apr 27, 2006
- APPLIED MATERIALS, INC.
- Judy H. Huang
- C30 - CRYSTAL GROWTH
Information Patent Application
Semiconductor device having silicon carbide and conductive pathway...
- Publication number 20050263900
- Publication date Dec 1, 2005
- APPLIED MATERIALS, INC.
- Judy H. Huang
- B08 - CLEANING
Information Patent Application
SILICON CARBIDE DEPOSITION FOR USE AS A LOW DIELECTRIC CONSTANT ANT...
- Publication number 20050181623
- Publication date Aug 18, 2005
- APPLIED MATERIALS, INC.
- Christopher Bencher
- C30 - CRYSTAL GROWTH
Information Patent Application
Plasma treatment to enhance adhesion and to minimize oxidation of c...
- Publication number 20050101154
- Publication date May 12, 2005
- JUDY HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated low k dielectrics and etch stops
- Publication number 20050023694
- Publication date Feb 3, 2005
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma treatment for copper oxide reduction
- Publication number 20040046260
- Publication date Mar 11, 2004
- APPLIED MATERIALS, INC.
- Judy H. Huang
- B08 - CLEANING
Information Patent Application
Hermetic silicon carbide
- Publication number 20030176080
- Publication date Sep 18, 2003
- Haiying Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON CARBIDE DEPOSITION FOR USE AS A BARRIER LAYER AND AN ETCH STOP
- Publication number 20030089992
- Publication date May 15, 2003
- SUDHA RATHI
- C30 - CRYSTAL GROWTH
Information Patent Application
SILICON CARBIDE DEPOSITION FOR USE AS A LOW-DIELECTRIC CONSTANT ANT...
- Publication number 20030030057
- Publication date Feb 13, 2003
- CHRISTOPHER BENCHER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma treatment for copper oxide reduction
- Publication number 20030022509
- Publication date Jan 30, 2003
- APPLIED MATERIALS, INC.
- Sudha Rathi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Intergrated low k dielectrics and etch stops
- Publication number 20020084257
- Publication date Jul 4, 2002
- APPLIED MATERIALS, INC.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for reducing copper oxidation and contamination in a semi...
- Publication number 20020081856
- Publication date Jun 27, 2002
- Judy H. Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR REDUCING FIXED CHARGES IN A SEMICONDUCTOR...
- Publication number 20020081759
- Publication date Jun 27, 2002
- JUDY HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated low k dielectrics and etch stops
- Publication number 20020074309
- Publication date Jun 20, 2002
- APPLIED MATERIALS, INC.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA TREATMENT TO ENHANCE ADHESION AND TO MINIMIZE OXIDATION OF C...
- Publication number 20020054962
- Publication date May 9, 2002
- JUDY HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for treating low k dielectric layers to reduce...
- Publication number 20020016085
- Publication date Feb 7, 2002
- Kegang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA TREATMENT FOR COOPER OXIDE REDUCTION
- Publication number 20010049181
- Publication date Dec 6, 2001
- SUDHA RATHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Judy H. Huang

Person

Patents Grantslast 30 patents

Inductive/capacitive hybrid plasma source and system with such chamber

Flowable film dielectric gap fill process

Method and apparatus for masking solar cell substrates for deposition

CVD flowable gap fill

Flowable film dielectric gap fill process

Semiconductor device having silicon carbide and conductive pathway...

CVD flowable gap fill

Flowable film dielectric gap fill process

H2-based plasma treatment to eliminate within-batch and batch-to-ba...

In situ deposition of a low κ dielectric layer, barrier layer, etch...

CVD flowable gap fill

Flowable film dielectric gap fill process

Stress profile modulation in STI gap fill

Halogen-free noble gas assisted H2 plasma etch process in depositio...

In situ deposition of a low K dielectric layer, barrier layer, etch...

Helium-based etch process in deposition-etch-deposition gap fill

Integrated low k dielectrics and etch stops

Hydrogen treatment enhanced gap fill

Plasma treatment to enhance adhesion and to minimize oxidation of c...

Method and apparatus for depositing antireflective coating

In situ deposition of a low κ dielectric layer, barrier layer, etch...

Silicon carbide deposition for use as a low dielectric constant ant...

Plasma treatment for copper oxide reduction

Integrated low K dielectrics and etch stops

Binder-enriched silicalite adhesion layer and apparatus for fabrica...

Plasma treatment to enhance adhesion and to minimize oxidation of c...

Method and apparatus for treating low k dielectric layers to reduce...

Hermetic silicon carbide

Plasma treatment for copper oxide reduction

Semiconductor device having reduced oxidation interface

Patents Applicationslast 30 patents

FLOWABLE FILM DIELECTRIC GAP FILL PROCESS

INDUCTIVE/CAPACITIVE HYBRID PLASMA SOURCE AND SYSTEM WITH SUCH CHAMBER

METHOD FOR REAR POINT CONTACT FABRICATION FOR SOLAR CELLS

METHOD AND APPARATUS FOR MASKING SUBSTRATES FOR DEPOSITION

METHOD AND APPARATUS FOR CHAMBER CLEANING BY IN-SITU PLASMA EXCITATION

IN SITU DEPOSITION OF A LOW K DIELECTRIC LAYER, BARRIER LAYER, ETCH...

SEMICONDUCTOR DEVICE HAVING SILICON CARBIDE AND CONDUCTIVE PATHWAY...

In situ deposition of a low K dielectric layer, barrier layer, etch...

Semiconductor device having silicon carbide and conductive pathway...

SILICON CARBIDE DEPOSITION FOR USE AS A LOW DIELECTRIC CONSTANT ANT...

Plasma treatment to enhance adhesion and to minimize oxidation of c...

Integrated low k dielectrics and etch stops

Plasma treatment for copper oxide reduction

Hermetic silicon carbide

SILICON CARBIDE DEPOSITION FOR USE AS A BARRIER LAYER AND AN ETCH STOP

SILICON CARBIDE DEPOSITION FOR USE AS A LOW-DIELECTRIC CONSTANT ANT...

Plasma treatment for copper oxide reduction

Intergrated low k dielectrics and etch stops

Apparatus for reducing copper oxidation and contamination in a semi...

METHOD AND APPARATUS FOR REDUCING FIXED CHARGES IN A SEMICONDUCTOR...

Integrated low k dielectrics and etch stops

PLASMA TREATMENT TO ENHANCE ADHESION AND TO MINIMIZE OXIDATION OF C...

Method and apparatus for treating low k dielectric layers to reduce...

PLASMA TREATMENT FOR COOPER OXIDE REDUCTION