Judy Schwartz

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Longmeadow, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Heat transfer interfaces for circuit card assembly (CCA) modules
- Patent number 12,075,587
- Issue date Aug 27, 2024
- Hamilton Sundstrand Corporation
- Alexander Trotman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit card assembly (CCA) module thermal interface devices
- Patent number 11,825,633
- Issue date Nov 21, 2023
- Hamilton Sundstrand Corporation
- Alexander Trotman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically mounted multi-hybrid module and heat sink
- Patent number 8,542,490
- Issue date Sep 24, 2013
- Hamilton Sundstrand Corporation
- Jay W. Kokas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT TRANSFER INTERFACES FOR CIRCUIT CARD ASSEMBLY (CCA) MODULES
- Publication number 20230262917
- Publication date Aug 17, 2023
- HAMILTON SUNDSTRAND CORPORATION
- Alexander Trotman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARD ASSEMBLY (CCA) MODULE THERMAL INTERFACE DEVICES
- Publication number 20230262941
- Publication date Aug 17, 2023
- Hamilton Sundstrand Corporation (HSC)
- Alexander Trotman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICALLY MOUNTED MULTI-HYBRID MODULE AND HEAT SINK
- Publication number 20120320530
- Publication date Dec 20, 2012
- Hamilton Sundstrand Corporation
- Jay W. Kokas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR