Juergen Boemmels

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for patterning vertical contacts an...
- Patent number 8,741,770
- Issue date Jun 3, 2014
- GLOBALFOUNDRIES Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual contact metallization including electroless plating in a semic...
- Patent number 8,658,494
- Issue date Feb 25, 2014
- GLOBALFOUNDRIES Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a grain orientation layer
- Patent number 8,404,577
- Issue date Mar 26, 2013
- GLOBALFOUNDRIES Inc.
- Juergen Boemmels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for patterning vertical contacts an...
- Patent number 8,198,190
- Issue date Jun 12, 2012
- GLOBALFOUNDRIES Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing metal voids in a metallization layer stack of a semiconduc...
- Patent number 8,097,536
- Issue date Jan 17, 2012
- Advanced Micro Devices, Inc.
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning a metallization layer by reducing resist stri...
- Patent number 8,048,811
- Issue date Nov 1, 2011
- Advanced Micro Devices, Inc.
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing non-uniformities during chemical mechanical poli...
- Patent number 8,039,398
- Issue date Oct 18, 2011
- GLOBALFOUNDRIES Inc.
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing leakage in dielectric materials including metal regions in...
- Patent number 7,781,329
- Issue date Aug 24, 2010
- Advanced Micro Devices, Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including field effect transistors laterally e...
- Patent number 7,767,593
- Issue date Aug 3, 2010
- Advanced Micro Devices, Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PATTERNING VERTICAL CONTACTS AN...
- Publication number 20120220119
- Publication date Aug 30, 2012
- GLOBALFOUNDRIES INC.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CONTACT METALLIZATION INCLUDING ELECTROLESS PLATING IN A SEMIC...
- Publication number 20110049713
- Publication date Mar 3, 2011
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING METAL VOIDS IN A METALLIZATION LAYER STACK OF A SEMICONDUC...
- Publication number 20100109161
- Publication date May 6, 2010
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING LEAKAGE IN DIELECTRIC MATERIALS INCLUDING METAL REGIONS IN...
- Publication number 20090325375
- Publication date Dec 31, 2009
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PATTERNING A METALLIZATION LAYER BY REDUCING RESIST STRI...
- Publication number 20090246951
- Publication date Oct 1, 2009
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PATTERNING VERTICAL CONTACTS AN...
- Publication number 20090108466
- Publication date Apr 30, 2009
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL PROTECTION LAYER
- Publication number 20090085173
- Publication date Apr 2, 2009
- Juergen Boemmels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING FIELD EFFECT TRANSISTORS LATERALLY E...
- Publication number 20090061645
- Publication date Mar 5, 2009
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A GRAIN ORIENTATION LAYER
- Publication number 20090035936
- Publication date Feb 5, 2009
- Juergen Boemmels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING NON-UNIFORMITIES DURING CHEMICAL MECHANICAL POLI...
- Publication number 20080206994
- Publication date Aug 28, 2008
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS

Juergen Boemmels

Person

Patents Grantslast 30 patents

Semiconductor device and method for patterning vertical contacts an...

Dual contact metallization including electroless plating in a semic...

Semiconductor device having a grain orientation layer

Semiconductor device and method for patterning vertical contacts an...

Reducing metal voids in a metallization layer stack of a semiconduc...

Method for patterning a metallization layer by reducing resist stri...

Method of reducing non-uniformities during chemical mechanical poli...

Reducing leakage in dielectric materials including metal regions in...

Semiconductor device including field effect transistors laterally e...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PATTERNING VERTICAL CONTACTS AN...

DUAL CONTACT METALLIZATION INCLUDING ELECTROLESS PLATING IN A SEMIC...

REDUCING METAL VOIDS IN A METALLIZATION LAYER STACK OF A SEMICONDUC...

REDUCING LEAKAGE IN DIELECTRIC MATERIALS INCLUDING METAL REGIONS IN...

METHOD FOR PATTERNING A METALLIZATION LAYER BY REDUCING RESIST STRI...

SEMICONDUCTOR DEVICE AND METHOD FOR PATTERNING VERTICAL CONTACTS AN...

SIDEWALL PROTECTION LAYER

SEMICONDUCTOR DEVICE INCLUDING FIELD EFFECT TRANSISTORS LATERALLY E...

SEMICONDUCTOR DEVICE HAVING A GRAIN ORIENTATION LAYER

METHOD OF REDUCING NON-UNIFORMITIES DURING CHEMICAL MECHANICAL POLI...