Juergen Foerster

Person

Tegernheim, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for making same
- Patent number 9,425,146
- Issue date Aug 23, 2016
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a chip package
- Patent number 8,912,087
- Issue date Dec 16, 2014
- Infineon Technologies AG
- Josef Hirtreiter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20160343662
- Publication date Nov 24, 2016
- INFINEON TECHNOLOGIES AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Deposition with Reduced Stress
- Publication number 20150235855
- Publication date Aug 20, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140264865
- Publication date Sep 18, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Deposition with Reduced Stress
- Publication number 20140117509
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140035127
- Publication date Feb 6, 2014
- INFINEON TECHNOLOGIES AG
- Josef Hirtreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120074572
- Publication date Mar 29, 2012
- Thomas FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR MAKING SAME
- Publication number 20120057270
- Publication date Mar 8, 2012
- Juergen FOERSTER
- H01 - BASIC ELECTRIC ELEMENTS

Juergen Foerster

Person

Patents Grantslast 30 patents

Semiconductor structure and method for making same

Method of fabricating a chip package

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Metal Deposition with Reduced Stress

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Metal Deposition with Reduced Stress

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

CAPACITOR AND METHOD FOR MAKING SAME