Juergen Hoegerl

Person

Regensberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Fluid-cooled package having shielding layer
- Patent number 11,862,533
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for fabricating the same
- Patent number 11,610,830
- Issue date Mar 21, 2023
- Infineon Technologies AG
- Christian Schweikert
- G01 - MEASURING TESTING
Information Patent Grant
Double sided semiconductor package
- Patent number 11,515,228
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor devices with sensor chip and busbar
- Patent number 11,493,538
- Issue date Nov 8, 2022
- Infineon Technologies AG
- Rainer Markus Schaller
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,410,906
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor devices having a sensor chip and busbar
- Patent number 11,385,301
- Issue date Jul 12, 2022
- Infineon Technologies AG
- Juergen Hoegerl
- G01 - MEASURING TESTING
Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 11,322,451
- Issue date May 3, 2022
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package cooled with cooling fluid and comprising shielding layer
- Patent number 11,244,886
- Issue date Feb 8, 2022
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with passive electrical component and method...
- Patent number 11,217,504
- Issue date Jan 4, 2022
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having overlapping electrically conductive re...
- Patent number 11,018,072
- Issue date May 25, 2021
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having symmetrically arranged power terminals...
- Patent number 11,004,764
- Issue date May 11, 2021
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an electromagnetic shielding structure...
- Patent number 10,985,110
- Issue date Apr 20, 2021
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module comprising transistor chips, diode chips and d...
- Patent number 10,964,642
- Issue date Mar 30, 2021
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with external power sensor
- Patent number 10,699,976
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with spatially limited thermally conductive mounting body
- Patent number 10,679,978
- Issue date Jun 9, 2020
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier with electrically conductive layer extending beyond th...
- Patent number 10,615,097
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier configured for delamination-free encapsulation and sta...
- Patent number 10,586,756
- Issue date Mar 10, 2020
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate package of chip on carrier and in cavity
- Patent number 10,522,433
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Juergen Hoegerl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with partially encapsulated cooling channel for cooling an...
- Patent number 10,461,017
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Andreas Grassmann
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package with roughened encapsulated surface for promoting adhesion
- Patent number 10,453,771
- Issue date Oct 22, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a plurality of encapsulation layers an...
- Patent number 10,418,313
- Issue date Sep 17, 2019
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with roughened encapsulated surface for promoting adhesion
- Patent number 10,410,949
- Issue date Sep 10, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling techniques for semiconductor package
- Patent number 10,373,890
- Issue date Aug 6, 2019
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sub-module including a leadframe and a semiconductor chi...
- Patent number 10,304,751
- Issue date May 28, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising a transistor chip module and a dri...
- Patent number 10,242,969
- Issue date Mar 26, 2019
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 10,211,158
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with interconnections having different melting temperatures
- Patent number 10,211,133
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertically spaced partially encapsulated contact struc...
- Patent number 10,128,165
- Issue date Nov 13, 2018
- Infineon Technologies AG
- Wolfram Hable
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having a dense arrangement of contact terminals
- Patent number 10,090,251
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE-SIDED COOLABLE SEMICONDUCTOR PACKAGE
- Publication number 20220319948
- Publication date Oct 6, 2022
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid-Cooled Package Having Shielding Layer
- Publication number 20220115293
- Publication date Apr 14, 2022
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Sided Semiconductor Package
- Publication number 20210134697
- Publication date May 6, 2021
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICES HAVING A SENSOR CHIP AND BUSBAR
- Publication number 20210088600
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Juergen HOEGERL
- G01 - MEASURING TESTING
Information Patent Application
SENSOR DEVICES WITH SENSOR CHIP AND BUSBAR
- Publication number 20210063445
- Publication date Mar 4, 2021
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20200395266
- Publication date Dec 17, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Method for Fabricating the Same
- Publication number 20200321262
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Christian Schweikert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Arrangement and Method for Fabricating a Power...
- Publication number 20200273778
- Publication date Aug 27, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING OVERLAPPING ELECTRICALLY CONDUCTIVE RE...
- Publication number 20200035580
- Publication date Jan 30, 2020
- INFINEON TECHNOLOGIES AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having Symmetrically Arranged Power Terminals...
- Publication number 20200035579
- Publication date Jan 30, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Passive Electrical Component and Method...
- Publication number 20200035581
- Publication date Jan 30, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having an Electromagnetic Shielding Structure...
- Publication number 20200035616
- Publication date Jan 30, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING TECHNIQUES FOR SEMICONDUCTOR PACKAGE
- Publication number 20190318976
- Publication date Oct 17, 2019
- INFINEON TECHNOLOGIES AG
- Juergen Hoegerl
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Power Semiconductor Module Having a Direct Copper Bonded Substrate...
- Publication number 20190221521
- Publication date Jul 18, 2019
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with interconnections having different melting temperatures
- Publication number 20190157192
- Publication date May 23, 2019
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH SPATIALLY LIMITED THERMALLY CONDUCTIVE MOUNTING BODY
- Publication number 20180301444
- Publication date Oct 18, 2018
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING TRANSISTOR CHIPS, DIODE CHIPS AND D...
- Publication number 20180211917
- Publication date Jul 26, 2018
- INFINEON TECHNOLOGIES AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with interconnections having different melting temperatures
- Publication number 20180138111
- Publication date May 17, 2018
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with vertically spaced partially encapsulated contact struc...
- Publication number 20180122720
- Publication date May 3, 2018
- INFINEON TECHNOLOGIES AG
- Wolfram HABLE
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Chip carrier with electrically conductive layer extending beyond th...
- Publication number 20180102302
- Publication date Apr 12, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip carrier configured for delamination-free encapsulation and sta...
- Publication number 20180096919
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Alexander ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with roughened encapsulated surface for promoting adhesion
- Publication number 20180082921
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package cooled with cooling fluid and comprising shielding layer
- Publication number 20180082925
- Publication date Mar 22, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with partially encapsulated cooling channel for cooling an...
- Publication number 20180040537
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- Andreas GRASSMANN
- B60 - VEHICLES IN GENERAL
Information Patent Application
Electronic Sub-Module Including a Leadframe and a Semiconductor Chi...
- Publication number 20170316999
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminate package of chip on carrier and in cavity
- Publication number 20170316994
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Juergen HOEGERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE COMPRISING LATERALLY EXTENDING CONNECTORS
- Publication number 20170200666
- Publication date Jul 13, 2017
- INFINEON TECHNOLOGIES AG
- Wolfram Hable
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Method for Producing a Number of Chip Assemblies and Method for Pro...
- Publication number 20170098580
- Publication date Apr 6, 2017
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Having a Dense Arrangement of Contact Terminals
- Publication number 20170025357
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated die
- Publication number 20170011982
- Publication date Jan 12, 2017
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS

Juergen Hoegerl

Person

Patents Grantslast 30 patents

Fluid-cooled package having shielding layer

Power semiconductor module and method for fabricating the same

Double sided semiconductor package

Sensor devices with sensor chip and busbar

Semiconductor package and method for fabricating a semiconductor pa...

Sensor devices having a sensor chip and busbar

Power semiconductor module having a direct copper bonded substrate...

Package cooled with cooling fluid and comprising shielding layer

Semiconductor package with passive electrical component and method...

Semiconductor package having overlapping electrically conductive re...

Semiconductor package having symmetrically arranged power terminals...

Semiconductor package having an electromagnetic shielding structure...

Semiconductor module comprising transistor chips, diode chips and d...

Semiconductor module with external power sensor

Chip module with spatially limited thermally conductive mounting body

Chip carrier with electrically conductive layer extending beyond th...

Chip carrier configured for delamination-free encapsulation and sta...

Laminate package of chip on carrier and in cavity

Package with partially encapsulated cooling channel for cooling an...

Package with roughened encapsulated surface for promoting adhesion

Electronic module comprising a plurality of encapsulation layers an...

Package with roughened encapsulated surface for promoting adhesion

Cooling techniques for semiconductor package

Electronic sub-module including a leadframe and a semiconductor chi...

Semiconductor package comprising a transistor chip module and a dri...

Power semiconductor module having a direct copper bonded substrate...

Package with interconnections having different melting temperatures

Package with vertically spaced partially encapsulated contact struc...

Semiconductor arrangement, semiconductor system and method of formi...

Semiconductor chip having a dense arrangement of contact terminals

Patents Applicationslast 30 patents

DOUBLE-SIDED COOLABLE SEMICONDUCTOR PACKAGE

Fluid-Cooled Package Having Shielding Layer

Double Sided Semiconductor Package

SENSOR DEVICES HAVING A SENSOR CHIP AND BUSBAR

SENSOR DEVICES WITH SENSOR CHIP AND BUSBAR

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

Power Semiconductor Module and Method for Fabricating the Same

Power Semiconductor Arrangement and Method for Fabricating a Power...

SEMICONDUCTOR PACKAGE HAVING OVERLAPPING ELECTRICALLY CONDUCTIVE RE...

Semiconductor Package Having Symmetrically Arranged Power Terminals...

Semiconductor Package with Passive Electrical Component and Method...

Semiconductor Package Having an Electromagnetic Shielding Structure...

COOLING TECHNIQUES FOR SEMICONDUCTOR PACKAGE

Power Semiconductor Module Having a Direct Copper Bonded Substrate...

Package with interconnections having different melting temperatures

CHIP MODULE WITH SPATIALLY LIMITED THERMALLY CONDUCTIVE MOUNTING BODY

SEMICONDUCTOR MODULE COMPRISING TRANSISTOR CHIPS, DIODE CHIPS AND D...

Package with interconnections having different melting temperatures

Package with vertically spaced partially encapsulated contact struc...

Chip carrier with electrically conductive layer extending beyond th...

Chip carrier configured for delamination-free encapsulation and sta...

Package with roughened encapsulated surface for promoting adhesion

Package cooled with cooling fluid and comprising shielding layer

Package with partially encapsulated cooling channel for cooling an...

Electronic Sub-Module Including a Leadframe and a Semiconductor Chi...

Laminate package of chip on carrier and in cavity

SEMICONDUCTOR CHIP PACKAGE COMPRISING LATERALLY EXTENDING CONNECTORS

Method for Producing a Number of Chip Assemblies and Method for Pro...

Semiconductor Chip Having a Dense Arrangement of Contact Terminals

Insulated die