Membership
Tour
Register
Log in
Juergen Leib
Follow
Person
Freising, DE
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method for packing semiconductor components and product produced ac...
Patent number
8,420,445
Issue date
Apr 16, 2013
Wafer-Level Packaging Portfolio LLC
Juergen Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for packaging electronic devices and integrated circuits
Patent number
8,399,293
Issue date
Mar 19, 2013
Wafer-Level Packaging Portfolio LLC
Juergen Leib
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for production of packaged electronic components, and a pack...
Patent number
8,324,024
Issue date
Dec 4, 2012
Schott AG
Juergen Leib
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Process for packaging components, and packaged components
Patent number
8,309,384
Issue date
Nov 13, 2012
Wafer-Level Packaging Portfolio LLC
Juergen Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for packaging electronic devices and integrated circuits
Patent number
8,017,435
Issue date
Sep 13, 2011
Wafer-Level Packaging Portfolio LLC
Juergen Leib
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Process for packaging components, and packaged components
Patent number
7,700,397
Issue date
Apr 20, 2010
Schott AG
Juergen Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glass composition exclusively consisting of oxides which already at...
Patent number
7,566,672
Issue date
Jul 28, 2009
Schott AG
Wolfgang Pannhorst
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Method for microstructuring flat glass substrates
Patent number
7,476,623
Issue date
Jan 13, 2009
Schott AG
Bianca Schreder
C03 - GLASS MINERAL OR SLAG WOOL
Patents Applications
last 30 patents
Information
Patent Application
Method for Packaging Electronic Devices and Integrated Circuits
Publication number
20120003791
Publication date
Jan 5, 2012
WAFER-LEVEL PACKAGING PORTFOLIO LLC
Juergen Leib
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR PACKING SEMICONDUCTOR COMPONENTS AND PRODUCT PRODUCED AC...
Publication number
20100283127
Publication date
Nov 11, 2010
Juergen Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR PACKAGING COMPONENTS, AND PACKAGED COMPONENTS
Publication number
20100187669
Publication date
Jul 29, 2010
Schott AG
Juergen Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for packaging electronic devices and integrated circuits
Publication number
20100059877
Publication date
Mar 11, 2010
SCHOTT AG
Juergen Leib
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method for production of packaged electronic components, and a pack...
Publication number
20090321867
Publication date
Dec 31, 2009
SCHOTT AG
Juergen Leib
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD FOR MICROSTRUCTURING FLAT GLASS SUBSTRATES
Publication number
20080257860
Publication date
Oct 23, 2008
Bianca Schreder
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Application
Process for Packaging Components, and Packaged Components
Publication number
20080038868
Publication date
Feb 14, 2008
Jüergen Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for microstructuring flat glass substrates
Publication number
20060079094
Publication date
Apr 13, 2006
Bianca Schreder
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Application
Method of making a hybrid housing and hybrid housing
Publication number
20050035092
Publication date
Feb 17, 2005
Robert Eder
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR