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Juergen Portmann
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Munich, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Wafer-level package and method for production thereof
Patent number
9,647,196
Issue date
May 9, 2017
Snaptrack, Inc.
Christian Bauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Component and method for producing a component
Patent number
9,382,110
Issue date
Jul 5, 2016
EPCOS AG
Christian Bauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Hermetically sealed housing for electronic components and manufactu...
Patent number
8,759,677
Issue date
Jun 24, 2014
EPCOS AG
Christian Bauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electric component with a flip-chip construction
Patent number
7,518,249
Issue date
Apr 14, 2009
EPCOS AG
Hans Krueger
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MULTI-LEVEL STACKED ACOUSTIC WAVE (AW) FILTER PACKAGES AND RELATED...
Publication number
20230090842
Publication date
Mar 23, 2023
RF360 EUROPE GMBH
Manuel Hofer
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
HIGH-POWER DIE HEAT SINK
Publication number
20220359337
Publication date
Nov 10, 2022
QUALCOMM TECHNOLOGIES, INC.
Jose MOREIRA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Component and Method for Producing a Component
Publication number
20140226285
Publication date
Aug 14, 2014
EPCOS AG
Christian Bauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Wafer-Level Package and Method for Production Thereof
Publication number
20140111062
Publication date
Apr 24, 2014
EPCOS AG
Christian Bauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Component and Method for Producing a Component
Publication number
20130214405
Publication date
Aug 22, 2013
EPCOS AG
Christian Bauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTU...
Publication number
20110114355
Publication date
May 19, 2011
EPCOS AG
Christian Bauer
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Component with Mechanically Loadable Connecting Surface
Publication number
20100116531
Publication date
May 13, 2010
Martin Maier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electric Component With A Flip-Chip Construction
Publication number
20080048317
Publication date
Feb 28, 2008
EPCOS AG
Hans Krueger
H01 - BASIC ELECTRIC ELEMENTS