Juergen Schwandner

Person

Garching, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 10,707,069
- Issue date Jul 7, 2020
- Siltronic AG
- Juergen Schwandner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the local polishing of a semiconductor wafer
- Patent number 9,533,394
- Issue date Jan 3, 2017
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing both sides of a semiconductor wafer
- Patent number 9,224,613
- Issue date Dec 29, 2015
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a semiconductor material wafer
- Patent number 9,193,026
- Issue date Nov 24, 2015
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 8,882,565
- Issue date Nov 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for the double-side polishing of a semiconductor wafer
- Patent number 8,721,390
- Issue date May 13, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a semiconductor wafer
- Patent number 8,685,270
- Issue date Apr 1, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 8,647,173
- Issue date Feb 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a substrate composed of semiconductor material
- Patent number 8,647,985
- Issue date Feb 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing an epitaxially coated semiconductor wafer
- Patent number 8,551,870
- Issue date Oct 8, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a semiconductor wafer
- Patent number 8,529,315
- Issue date Sep 10, 2013
- Siltronic AG
- Juergen Schwandner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for grinding a semiconductor wafer
- Patent number 8,501,028
- Issue date Aug 6, 2013
- Siltronic AG
- Juergen Schwandner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 8,500,516
- Issue date Aug 6, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad and method for polishing a semiconductor wafer
- Patent number 8,444,455
- Issue date May 21, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing the edge of a semiconductor wafer
- Patent number 8,388,411
- Issue date Mar 5, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a semiconductor wafer
- Patent number 8,389,409
- Issue date Mar 5, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chemically grinding a semiconductor wafer on both sides
- Patent number 8,376,810
- Issue date Feb 19, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for the double sided polishing of a semiconductor wafer
- Patent number 8,376,811
- Issue date Feb 19, 2013
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a semiconductor wafer
- Patent number 8,343,873
- Issue date Jan 1, 2013
- Siltronic AG
- Juergen Schwandner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing a semiconductor wafer with a strained-relaxed...
- Patent number 8,338,302
- Issue date Dec 25, 2012
- Siltronic AG
- Juergen Schwandner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER
- Publication number 20140370786
- Publication date Dec 18, 2014
- Juergen Schwandner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR MATERIAL WAFER
- Publication number 20140287656
- Publication date Sep 25, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20130189904
- Publication date Jul 25, 2013
- Siltronic AG
- Juergen SCHWANDNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing Pad and Method For Polishing A Semiconductor Wafer
- Publication number 20130157543
- Publication date Jun 20, 2013
- Siltronic AG
- Juergen Schwandner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER
- Publication number 20130072091
- Publication date Mar 21, 2013
- Siltronic AG
- Juergen Schwandner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
- Publication number 20120149198
- Publication date Jun 14, 2012
- Siltronic AG
- Juergen SCHWANDNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER
- Publication number 20110244762
- Publication date Oct 6, 2011
- Siltronic AG
- Juergen SCHWANDNER
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20110244760
- Publication date Oct 6, 2011
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20110223841
- Publication date Sep 15, 2011
- Siltronic AG
- Juergen Schwandner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
- Publication number 20110183582
- Publication date Jul 28, 2011
- Siltronic AG
- Juergen Schwandner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
- Publication number 20110133314
- Publication date Jun 9, 2011
- Siltronic AG
- Georg Pietsch
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20110111677
- Publication date May 12, 2011
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
- Publication number 20110097975
- Publication date Apr 28, 2011
- Siltronic AG
- Juergen SCHWANDNER
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20110097974
- Publication date Apr 28, 2011
- Siltronic AG
- Juergen SCHWANDNER
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SEMICONDUCTOR WAFERS
- Publication number 20110081840
- Publication date Apr 7, 2011
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR GRINDING A SEMICONDUCTOR WAFER
- Publication number 20110081836
- Publication date Apr 7, 2011
- Siltronic AG
- Juergen SCHWANDNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing Pad and Method For Polishing A Semiconductor Wafer
- Publication number 20100330882
- Publication date Dec 30, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For Producing A Semiconductor Wafer
- Publication number 20100327414
- Publication date Dec 30, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For The Local Polishing Of A Semiconductor Wafer
- Publication number 20100330883
- Publication date Dec 30, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For Producing An Epitaxially Coated Semiconductor Wafer
- Publication number 20100330786
- Publication date Dec 30, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For The Double Sided Polishing Of A Semiconductor Wafer
- Publication number 20100330881
- Publication date Dec 30, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For Polishing The Edge Of A Semiconductor Wafer
- Publication number 20100330885
- Publication date Dec 30, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For Chemically Grinding A Semiconductor Wafer On Both Sides
- Publication number 20100323585
- Publication date Dec 23, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For Polishing A Semiconductor Wafer With A Strained-Relaxed...
- Publication number 20100130012
- Publication date May 27, 2010
- Siltronic AG
- Juergen Schwandner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR POLISHING BOTH SIDES OF A SEMICONDUCTOR WAFER
- Publication number 20100104806
- Publication date Apr 29, 2010
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Method For Polishing A Substrate Composed Of Semiconductor Material
- Publication number 20090029552
- Publication date Jan 29, 2009
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Methods for the single-sided polishing of semiconductor wafers and...
- Publication number 20080265375
- Publication date Oct 30, 2008
- Siltronic AG
- Georg Pietsch
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Juergen Schwandner

Person

Patents Grantslast 30 patents

Method for polishing a semiconductor wafer

Method for the local polishing of a semiconductor wafer

Method for polishing both sides of a semiconductor wafer

Method for polishing a semiconductor material wafer

Method for polishing a semiconductor wafer

Method for the double-side polishing of a semiconductor wafer

Method for producing a semiconductor wafer

Method for polishing a semiconductor wafer

Method for polishing a substrate composed of semiconductor material

Method for producing an epitaxially coated semiconductor wafer

Method for producing a semiconductor wafer

Method for grinding a semiconductor wafer

Method for polishing a semiconductor wafer

Polishing pad and method for polishing a semiconductor wafer

Method for polishing the edge of a semiconductor wafer

Method for producing a semiconductor wafer

Method for chemically grinding a semiconductor wafer on both sides

Method for the double sided polishing of a semiconductor wafer

Method for producing a semiconductor wafer

Method for polishing a semiconductor wafer with a strained-relaxed...

Patents Applicationslast 30 patents

METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER

METHOD FOR POLISHING A SEMICONDUCTOR MATERIAL WAFER

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Polishing Pad and Method For Polishing A Semiconductor Wafer

METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER

METHOD FOR PRODUCING A SEMICONDUCTOR WAFER

METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

METHOD FOR PRODUCING A SEMICONDUCTOR WAFER

METHOD FOR PRODUCING A SEMICONDUCTOR WAFER

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

METHOD FOR PRODUCING A SEMICONDUCTOR WAFER

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

METHOD FOR POLISHING SEMICONDUCTOR WAFERS

METHOD FOR GRINDING A SEMICONDUCTOR WAFER

Polishing Pad and Method For Polishing A Semiconductor Wafer

Method For Producing A Semiconductor Wafer

Method For The Local Polishing Of A Semiconductor Wafer

Method For Producing An Epitaxially Coated Semiconductor Wafer

Method For The Double Sided Polishing Of A Semiconductor Wafer

Method For Polishing The Edge Of A Semiconductor Wafer

Method For Chemically Grinding A Semiconductor Wafer On Both Sides

Method For Polishing A Semiconductor Wafer With A Strained-Relaxed...

METHOD FOR POLISHING BOTH SIDES OF A SEMICONDUCTOR WAFER

Method For Polishing A Substrate Composed Of Semiconductor Material

Methods for the single-sided polishing of semiconductor wafers and...