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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 12,132,007
    • Issue date Oct 29, 2024
    • Samsung Electronics Co., Ltd.
    • Jongwan Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,581,266
    • Issue date Feb 14, 2023
    • Samsung Electronics Co., Ltd.
    • Jongwan Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,437,326
    • Issue date Sep 6, 2022
    • Samsung Electronics Co., Ltd.
    • Juhyeon Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with a trench portion
    • Patent number 11,217,517
    • Issue date Jan 4, 2022
    • Samsung Electronics Co., Ltd.
    • Juhyeon Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 10,825,774
    • Issue date Nov 3, 2020
    • Samsung Electronics Co., Ltd.
    • Juhyeon Oh
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240347401
    • Publication date Oct 17, 2024
    • Samsung Electronics Co., Ltd.
    • KYONG HWAN KOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240170382
    • Publication date May 23, 2024
    • Samsung Electronics Co., Ltd.
    • Juhyeon Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240079299
    • Publication date Mar 7, 2024
    • Samsung Electronics Co., Ltd.
    • Jaekyung YOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230170310
    • Publication date Jun 1, 2023
    • Samsung Electronics Co., Ltd.
    • JONGWAN KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220392846
    • Publication date Dec 8, 2022
    • Samsung Electronics Co., Ltd.
    • JUHYEON OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220068835
    • Publication date Mar 3, 2022
    • Samsung Electronics Co., Ltd.
    • JONGWAN KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220051957
    • Publication date Feb 17, 2022
    • Samsung Electronics Co., Ltd.
    • KYONG HWAN KOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210035895
    • Publication date Feb 4, 2021
    • Samsung Electronics Co., Ltd.
    • JUHYEON OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210013152
    • Publication date Jan 14, 2021
    • Samsung Electronics Co., Ltd.
    • JUHYEON OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20200043854
    • Publication date Feb 6, 2020
    • Samsung Electronics Co., Ltd.
    • JUHYEON OH
    • H01 - BASIC ELECTRIC ELEMENTS