Juhyun LYU

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,735,494
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Hee-Jeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat dissipation member
- Patent number 11,670,565
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Hyo-Chang Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal interface material for improving...
- Patent number 11,569,145
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Sanghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,114,364
- Issue date Sep 7, 2021
- Samsung Electronics Co., Ltd.
- Hee-Jeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting semiconductor chip
- Patent number 8,240,541
- Issue date Aug 14, 2012
- Samsung Electronics Co., Ltd.
- Juhyun Lyu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING PACKAGE RELIABILITY
- Publication number 20210384096
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Sanghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210384100
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Hyo-Chang RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210384101
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Hee-Jeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200020606
- Publication date Jan 16, 2020
- Samsung Electronics Co., Ltd.
- Hee-Jeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR MOUNTING SEMICONDUCTOR CHIPS
- Publication number 20130167369
- Publication date Jul 4, 2013
- Samsung Electronics Co., Ltd.
- Joo-Young OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MOUNTING SEMICONDUCTOR CHIP
- Publication number 20120104074
- Publication date May 3, 2012
- Samsung Electronics Co., Ltd.
- Juhyun LYU
- H01 - BASIC ELECTRIC ELEMENTS