JuHyun Park

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with base structure device
- Patent number 7,915,724
- Issue date Mar 29, 2011
- Stats Chippac Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,498,667
- Issue date Mar 3, 2009
- Stats Chippac Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,368,319
- Issue date May 6, 2008
- Stats Chippac Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BASE STRUCTURE DEVICE
- Publication number 20090085178
- Publication date Apr 2, 2009
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20070241453
- Publication date Oct 18, 2007
- STATS ChipPAC Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20070241442
- Publication date Oct 18, 2007
- STATS ChipPAC Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20070218689
- Publication date Sep 20, 2007
- STATS ChipPAC Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS