Jui-Chang Kuo

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,062,832
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,282,810
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 11,075,439
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated fan-out package
- Patent number 10,756,052
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated fan-out package
- Patent number 10,366,966
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240356199
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210351491
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200335477
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200044306
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED FAN-OUT PACKAGE
- Publication number 20190355694
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS