Jui-Ching Hsieh

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure and method of fabricating the same
- Patent number 7,989,948
- Issue date Aug 2, 2011
- Industrial Technology Research Institute
- Jui-Ching Hsieh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
HEAT TAKE-OUT DEVICE
- Publication number 20130167530
- Publication date Jul 4, 2013
- Industrial Technology Research Institute
- Jui-Ching HSIEH
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20100139767
- Publication date Jun 10, 2010
- Industrial Technology Research Institute
- Jui-Ching Hsieh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...