Jui-Chun Weng

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pellicle frame with stress relief trenches
- Patent number 12,130,551
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hao Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 12,092,839
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Roughness selectivity for MEMS movement stiction reduction
- Patent number 12,054,382
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photomask assembly and method of forming the same
- Patent number 11,789,360
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hao Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,782,284
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer bonding alignment
- Patent number 11,742,320
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,726,342
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pellicle frame with stress relief trenches
- Patent number 11,726,401
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hao Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Roughness selectivity for MEMS movement stiction reduction
- Patent number 11,655,138
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsi-Cheng Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical sensor and methods of making the same
- Patent number 11,514,707
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- You-Cheng Jhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,454,820
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 11,448,891
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pellicle frame with stress relief trenches
- Patent number 11,415,878
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hao Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 11,407,636
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photomask assembly and method of forming the same
- Patent number 11,392,024
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hao Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 11,305,980
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heater design for MEMS chamber pressure control
- Patent number 10,532,925
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 10,513,432
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 10,155,656
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heater design for MEMS chamber pressure control
- Patent number 10,131,536
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal-insulator-metal (MIM) capacitor with an electrode scheme for...
- Patent number 9,966,427
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective nitride outgassing process for MEMS cavity pressure control
- Patent number 9,884,758
- Issue date Feb 6, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a motion sensor device
- Patent number 9,880,192
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating MEMS devices having a plurality of cavities
- Patent number 9,561,954
- Issue date Feb 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Movement microelectromechanical systems (MEMS) package
- Patent number 9,527,721
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mechanism for forming MEMS device
- Patent number 9,090,452
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Motion sensor device and methods for forming the same
- Patent number 8,960,003
- Issue date Feb 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- G01 - MEASURING TESTING
Information Patent Grant
MEMS devices having a plurality of cavities
- Patent number 8,916,943
- Issue date Dec 23, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Delamination resistant semiconductor film and method for forming th...
- Patent number 8,846,149
- Issue date Sep 30, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuh-Hwa Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
TEST STRUCTURE AND INTEGRATED CIRCUIT TEST USING SAME
- Publication number 20250054817
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Wei-Kuan Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20240361609
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Plasmon Resonance Sensor, Surface Plasmon Resonance Sensing...
- Publication number 20240248033
- Publication date Jul 25, 2024
- Academia Sinica
- Chia-Fu CHOU
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240051818
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20230400699
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20230384664
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hao LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20230359056
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING ALIGNMENT
- Publication number 20230352445
- Publication date Nov 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PELLICLE FRAME WITH STRESS RELIEF TRENCHES
- Publication number 20230324787
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hao LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION
- Publication number 20230264945
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20220382069
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20220373815
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G02 - OPTICS
Information Patent Application
PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20220365423
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hao LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PELLICLE FRAME WITH STRESS RELIEF TRENCHES
- Publication number 20220365424
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hao LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20220348454
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER BONDING ALIGNMENT
- Publication number 20220293557
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20220242724
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co.,Ltd
- Jui-Chun WENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME
- Publication number 20220155670
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Hao LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION
- Publication number 20220135397
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PELLICLE FRAME WITH STRESS RELIEF TRENCHES
- Publication number 20220082931
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Hao LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MUTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20210116713
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20210116714
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20200123003
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTI-STICTION PROCESS FOR MEMS DEVICE
- Publication number 20190031503
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Chun WENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL
- Publication number 20190010047
- Publication date Jan 10, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20180370790
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR WITH AN ELECTRODE SCHEME FOR...
- Publication number 20170330931
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE NITRIDE OUTGASSING PROCESS FOR MEMS CAVITY PRESSURE CONTROL
- Publication number 20170203962
- Publication date Jul 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL
- Publication number 20170107100
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20170107097
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jui-Chun Weng

Person

Patents Grantslast 30 patents

Anti-stiction process for MEMS device

Pellicle frame with stress relief trenches

Multifunctional collimator for contact image sensors

Roughness selectivity for MEMS movement stiction reduction

Photomask assembly and method of forming the same

Multifunctional collimator for contact image sensors

Wafer bonding alignment

Multifunctional collimator for contact image sensors

Pellicle frame with stress relief trenches

Roughness selectivity for MEMS movement stiction reduction

Optical sensor and methods of making the same

Multifunctional collimator for contact image sensors

Multifunctional collimator for contact image sensors

Pellicle frame with stress relief trenches

Inter-poly connection for parasitic capacitor and die size improvement

Photomask assembly and method of forming the same

Anti-stiction process for MEMS device

Heater design for MEMS chamber pressure control

Anti-stiction process for MEMS device

Inter-poly connection for parasitic capacitor and die size improvement

Heater design for MEMS chamber pressure control

Metal-insulator-metal (MIM) capacitor with an electrode scheme for...

Selective nitride outgassing process for MEMS cavity pressure control

Method of manufacturing a motion sensor device

Method of fabricating MEMS devices having a plurality of cavities

Movement microelectromechanical systems (MEMS) package

Mechanism for forming MEMS device

Motion sensor device and methods for forming the same

MEMS devices having a plurality of cavities

Delamination resistant semiconductor film and method for forming th...

Patents Applicationslast 30 patents

TEST STRUCTURE AND INTEGRATED CIRCUIT TEST USING SAME

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

Surface Plasmon Resonance Sensor, Surface Plasmon Resonance Sensing...

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

WAFER BONDING ALIGNMENT

PELLICLE FRAME WITH STRESS RELIEF TRENCHES

ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME

PELLICLE FRAME WITH STRESS RELIEF TRENCHES

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

WAFER BONDING ALIGNMENT

ANTI-STICTION PROCESS FOR MEMS DEVICE

PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME

ROUGHNESS SELECTIVITY FOR MEMS MOVEMENT STICTION REDUCTION

PELLICLE FRAME WITH STRESS RELIEF TRENCHES

MUTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

ANTI-STICTION PROCESS FOR MEMS DEVICE

ANTI-STICTION PROCESS FOR MEMS DEVICE

HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

METAL-INSULATOR-METAL (MIM) CAPACITOR WITH AN ELECTRODE SCHEME FOR...

SELECTIVE NITRIDE OUTGASSING PROCESS FOR MEMS CAVITY PRESSURE CONTROL

HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT