Jui-Chung Ho

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Taichung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure for semiconductor package
- Patent number 9,013,042
- Issue date Apr 21, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20140061928
- Publication date Mar 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS