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Jui-Chung Lee

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  • Touliu, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Circuit board
    • Patent number 11,678,439
    • Issue date Jun 13, 2023
    • Macronix International Co., Ltd.
    • Pei-Chi Hu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of fabricating circuit board
    • Patent number 11,304,310
    • Issue date Apr 12, 2022
    • Macronix International Co., Ltd.
    • Pei-Chi Hu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Integrated circuit and method of operating the same
    • Patent number 8,547,233
    • Issue date Oct 1, 2013
    • Macronix International Co., Ltd.
    • Jui-Chung Lee
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    IC package tray embedded RFID
    • Patent number 8,240,549
    • Issue date Aug 14, 2012
    • Macronix International Co., Ltd.
    • Jui-Chung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Leadframe
    • Patent number 8,133,759
    • Issue date Mar 13, 2012
    • Macronix International Co., Ltd.
    • Jui-Chung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor packaging device and manufacture thereof
    • Patent number 7,122,904
    • Issue date Oct 17, 2006
    • Macronix International Co., Ltd.
    • Chen-Jung Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-chip package
    • Patent number 7,105,869
    • Issue date Sep 12, 2006
    • Macronix International Co., Ltd.
    • Jui-Chung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor packaging device
    • Patent number 6,977,436
    • Issue date Dec 20, 2005
    • Macronix International Co. Ltd.
    • Chen-Jung Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stacked semiconductor packaging device
    • Patent number 6,650,008
    • Issue date Nov 18, 2003
    • Macronix International Co., Ltd.
    • Chen-Jung Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multiple-step inner lead of leadframe
    • Patent number 6,559,526
    • Issue date May 6, 2003
    • Macronix International Co., Ltd.
    • Jui-Chung Lee
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250054909
    • Publication date Feb 13, 2025
    • Macronix International Co., Ltd.
    • Kai-Shiang HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20220183162
    • Publication date Jun 9, 2022
    • Macronix International Co., Ltd.
    • Pei-Chi HU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF FABRICATING CIRCUIT BOARD
    • Publication number 20220117093
    • Publication date Apr 14, 2022
    • Macronix International Co., Ltd.
    • Pei-Chi HU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTEGRATED CIRCUIT AND METHOD OF OPERATING THE SAME
    • Publication number 20120051491
    • Publication date Mar 1, 2012
    • Macronix International Co., Ltd.
    • Jui-Chung Lee
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    IC PACKAGE TRAY EMBEDDED RFID
    • Publication number 20110024326
    • Publication date Feb 3, 2011
    • Macronix International Co., Ltd.
    • JUI-CHUNG LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Leadframe
    • Publication number 20100270665
    • Publication date Oct 28, 2010
    • MACRONIX INTERNATIONAL CO., LTD
    • Jui-Chung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGING DEVICE AND MANUFACTURE THEREOF
    • Publication number 20070018333
    • Publication date Jan 25, 2007
    • Macronix International Co., Ltd.
    • Chen-Jung Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-chip package
    • Publication number 20060097282
    • Publication date May 11, 2006
    • Jui-Chung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ultra thin stacking packaging device
    • Publication number 20040021230
    • Publication date Feb 5, 2004
    • MACRONIX INTERNATIONAL CO., LTD
    • Chen-Jung Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor package body having a lead frame with enhanced heat d...
    • Publication number 20040000703
    • Publication date Jan 1, 2004
    • Jui-chung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor packaging device and manufacture thereof
    • Publication number 20030201521
    • Publication date Oct 30, 2003
    • MACRONIX INTERNATIONAL CO., LTD
    • Chen-Jung Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED SEMICONDUCTOR PACKAGING DEVICE
    • Publication number 20030183917
    • Publication date Oct 2, 2003
    • MACRONIX INTERNATIONAL CO., LTD
    • Chen-Jung Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor packaging device and manufacture thereof
    • Publication number 20030151143
    • Publication date Aug 14, 2003
    • MACRONIX INTERNATIONAL CO., LTD
    • Chen-Jung Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Three-dimension multi-chip stack package technology
    • Publication number 20020180020
    • Publication date Dec 5, 2002
    • Chih-Wen Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Three-dimension multi-chip stack package technology
    • Publication number 20020180021
    • Publication date Dec 5, 2002
    • MACRONIX INTERNATIONAL CO., LTD
    • Chih-Wen Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multiple-step inner lead of leadframe
    • Publication number 20020158316
    • Publication date Oct 31, 2002
    • MACRONIX INTERNATIONAL CO., LTD
    • Jui-Chung Lee
    • H01 - BASIC ELECTRIC ELEMENTS