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New Taipei, TW
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last 30 patents
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Patent Grant
Camera module and method for manufacturing the camera module
Patent number
9,531,929
Issue date
Dec 27, 2016
Cheng Uei Precision Industry Co., Ltd.
Jui Hsiang Lo
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
Publication number
20230402417
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAMERA MODULE AND METHOD FOR MANUFACTURING THE CAMERA MODULE
Publication number
20170085758
Publication date
Mar 23, 2017
Cheng Uei Precision Industry Co., LTD.
Jui Hsiang Lo
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
FLIP CHIP PACKAGING STRUCTURE
Publication number
20130140664
Publication date
Jun 6, 2013
Cheng Uei Precision Industry Co., LTD.
JUI-HSIANG LO
H01 - BASIC ELECTRIC ELEMENTS