Jui-Ming Ni

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Chu-Pei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming electrically conductive bumps and devices formed
- Patent number 6,767,818
- Issue date Jul 27, 2004
- Industrial Technology Research Institute
- Shyh-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for packaging organic electroluminescent components with pol...
- Publication number 20040150332
- Publication date Aug 5, 2004
- Windell Corporation
- Chin-Pei Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for packaging organic electroluminescent components with pol...
- Publication number 20030048074
- Publication date Mar 13, 2003
- Jui-Ming Ni
- H01 - BASIC ELECTRIC ELEMENTS