TREA

Jui-Mu CHO

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  • Chupei, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer bonding method and wafer bonding apparatus
    • Patent number 11,721,662
    • Issue date Aug 8, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Yun-Tai Shih
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding alignment tool
    • Patent number 10,847,490
    • Issue date Nov 24, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Yun-Tai Shih
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Bonding alignment tool
    • Patent number 10,396,054
    • Issue date Aug 27, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Yun-Tai Shih
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Detection method for electroplating process
    • Patent number 10,345,254
    • Issue date Jul 9, 2019
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Yung-Chang Huang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Bonding alignment tool and method
    • Patent number 9,123,754
    • Issue date Sep 1, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai Shih
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

  • Information Patent Application

    ATOMIC LAYER DEPOSITION (ALD) WITH IMPROVED PARTICLE PREVENTION MEC...
    • Publication number 20250043420
    • Publication date Feb 6, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chung Hsien Liao
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SYSTEMS AND METHODS FOR ACCURATE DETERMINATION OF SEMICONDUCTOR WAF...
    • Publication number 20250046633
    • Publication date Feb 6, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chung Hsien Liao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEM AND METHOD OF MONITORING PRECURSOR TANK
    • Publication number 20240344976
    • Publication date Oct 17, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-Hsi WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER BONDING METHOD AND WAFER BONDING APPARATUS
    • Publication number 20210050324
    • Publication date Feb 18, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai SHIH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING ALIGNMENT TOOL
    • Publication number 20190378813
    • Publication date Dec 12, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai SHIH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DETECTION METHOD FOR ELECTROPLATING PROCESS
    • Publication number 20180372665
    • Publication date Dec 27, 2018
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yung-Chang HUANG
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROPLATING APPARATUS AND METHOD
    • Publication number 20160222537
    • Publication date Aug 4, 2016
    • Taiwan Semiconductor Manufacturing company Ltd.
    • YUNG DI SHEN
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    BONDING ALIGNMENT TOOL
    • Publication number 20150340337
    • Publication date Nov 26, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai SHIH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING ALIGNMENT TOOL AND METHOD
    • Publication number 20130086786
    • Publication date Apr 11, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yun-Tai SHIH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RF coil design for improved film uniformity of an ion metal plasma...
    • Publication number 20050098427
    • Publication date May 12, 2005
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Jui-Mu Cho
    • H01 - BASIC ELECTRIC ELEMENTS