Jui-Yu Chuang

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with lead frame as chip carrier and method fo...
- Patent number 7,339,280
- Issue date Mar 4, 2008
- Siliconware Precision Industries Co., Ltd.
- Jui-Yu Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC card type circuit module
- Patent number D529031
- Issue date Sep 26, 2006
- Siliconware Precision Industries Co., Ltd.
- Chih-Ming Huang
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Heat sink with collapse structure for semiconductor package
- Patent number 6,858,931
- Issue date Feb 22, 2005
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window-type ball grid array semiconductor package with lead frame a...
- Patent number 6,847,104
- Issue date Jan 25, 2005
- Siliconware Precision Industries Co., Ltd.
- Chien Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having vertically mounted passive devices und...
- Patent number 6,781,222
- Issue date Aug 24, 2004
- Siliconware Precision Industries Co., Ltd.
- Chi Chuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC card type circuit module
- Patent number D492314
- Issue date Jun 29, 2004
- Siliconware Precision Industries Co., Ltd.
- Chih-Ming Huang
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Method of mounting a passive component over an integrated circuit p...
- Patent number 6,673,690
- Issue date Jan 6, 2004
- Siliconware Precision Industries Co., Ltd.
- Jui Yu Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink with collapse structure and semiconductor package with he...
- Patent number 6,538,321
- Issue date Mar 25, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package structure
- Patent number 6,483,178
- Issue date Nov 19, 2002
- Siliconware Precision Industries Co., Ltd.
- Jui-Yu Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat dissipating structure
- Patent number 6,472,743
- Issue date Oct 29, 2002
- Siliconware Precision Industries, Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting an exposed-pad type of semiconductor device over...
- Patent number 6,455,355
- Issue date Sep 24, 2002
- Siliconware Precision Industries, Co., Ltd.
- Chieh-Yuan Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package with lead frame as chip carrier and method fo...
- Publication number 20040084758
- Publication date May 6, 2004
- Siliconware Precision Industries, Ltd.
- Jui-Yu Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window-type ball grid array semiconductor package with lead frame a...
- Publication number 20040080031
- Publication date Apr 29, 2004
- Siliconware Precision Industries, Ltd., Taiwan
- Chien Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink with collapse structure and semiconductor package with he...
- Publication number 20030089976
- Publication date May 15, 2003
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING AN EXPOSED-PAD TYPE OF SEMICONDUCTOR DEVICE OVER...
- Publication number 20020146863
- Publication date Oct 10, 2002
- Chieh-Yuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink with collapse structure and semiconductor package with he...
- Publication number 20020135076
- Publication date Sep 26, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE
- Publication number 20020113308
- Publication date Aug 22, 2002
- Siliconware Precision Industries Co. Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting a passive component over an integrated circuit p...
- Publication number 20020098621
- Publication date Jul 25, 2002
- Jui Yu Chuang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package and fabricating method thereof
- Publication number 20020086500
- Publication date Jul 4, 2002
- Siliconware Precision Industries, Co., Ltd.
- Chi Chuan Wu
- H01 - BASIC ELECTRIC ELEMENTS

Jui-Yu Chuang

Person

Patents Grantslast 30 patents

Semiconductor package with lead frame as chip carrier and method fo...

IC card type circuit module

Heat sink with collapse structure for semiconductor package

Window-type ball grid array semiconductor package with lead frame a...

Semiconductor package having vertically mounted passive devices und...

IC card type circuit module

Method of mounting a passive component over an integrated circuit p...

Heat sink with collapse structure and semiconductor package with he...

Semiconductor device package structure

Semiconductor package with heat dissipating structure

Method of mounting an exposed-pad type of semiconductor device over...

Patents Applicationslast 30 patents

Semiconductor package with lead frame as chip carrier and method fo...

Window-type ball grid array semiconductor package with lead frame a...

Heat sink with collapse structure and semiconductor package with he...

METHOD OF MOUNTING AN EXPOSED-PAD TYPE OF SEMICONDUCTOR DEVICE OVER...

Heat sink with collapse structure and semiconductor package with he...

SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE

Method of mounting a passive component over an integrated circuit p...

Semiconductor package and fabricating method thereof