Juil EOM

Follow

Person

Guri-si Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Stack packages including through mold via structures
- Patent number 11,342,315
- Issue date May 24, 2022
- SK Hynix Inc.
- Juil Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having EMI shielding layers
- Patent number 10,923,434
- Issue date Feb 16, 2021
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including through mold vias
- Patent number 10,665,570
- Issue date May 26, 2020
- SK hynix Inc.
- Juil Eom
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACK PACKAGES INCLUDING THROUGH MOLD VIAS
- Publication number 20190333894
- Publication date Oct 31, 2019
- SK HYNIX INC.
- Juil EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING THROUGH MOLD VIA STRUCTURES
- Publication number 20190333899
- Publication date Oct 31, 2019
- SK HYNIX INC.
- Juil EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING EMI SHIELDING LAYERS
- Publication number 20190333865
- Publication date Oct 31, 2019
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH SIGNAL TRANSMISSION PATHS RELATING TO PARAS...
- Publication number 20190080999
- Publication date Mar 14, 2019
- SK HYNIX INC.
- Juil EOM
- H01 - BASIC ELECTRIC ELEMENTS