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Jules J. Poisson
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Canton de Shefford, CA
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last 30 patents
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Patent Grant
Wafer level packaging technique for microdevices
Patent number
7,138,293
Issue date
Nov 21, 2006
Dalsa Semiconductor Inc.
Luc Ouellet
B81 - MICRO-STRUCTURAL TECHNOLOGY
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last 30 patents
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Patent Application
Wafer level packaging technique for microdevices
Publication number
20040067604
Publication date
Apr 8, 2004
Luc Ouellet
B81 - MICRO-STRUCTURAL TECHNOLOGY