Julia M. Wu

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Las Flores, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Densely packed metal segments patterned in a semiconductor die
- Patent number 7,709,949
- Issue date May 4, 2010
- Newport Fab, LLC
- Tinghao F. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning densely packed metal segments in a semiconduc...
- Patent number 6,919,272
- Issue date Jul 19, 2005
- Newport Fab, LLC
- Tinghao F. Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Densely packed metal segments patterned in a semiconductor die
- Publication number 20090243114
- Publication date Oct 1, 2009
- Newport Fab, LLC dba Jazz Semiconductor.
- Tinghao F. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for patterning densely packed metal segments in a semiconduc...
- Publication number 20040152302
- Publication date Aug 5, 2004
- Newport Fab, LLC dba Jazz Semiconductor.
- Tinghao F. Wang
- H01 - BASIC ELECTRIC ELEMENTS