Julia Roe

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Hillsborough, NC, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafers including patterned back side layers thereon
- Patent number 8,643,177
- Issue date Feb 4, 2014
- Amkor Technology, Inc.
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming back side layers for thinned wafers
- Patent number 7,871,899
- Issue date Jan 18, 2011
- Amkor Technology, Inc.
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of Forming Back Side Layers For Thinned Wafers and Related...
- Publication number 20110079901
- Publication date Apr 7, 2011
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Back Side Layers for Thinned Wafers and Related...
- Publication number 20070161234
- Publication date Jul 12, 2007
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS