Julia Zischang

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Villach, AT

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 12,183,696
- Issue date Dec 31, 2024
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 11,764,176
- Issue date Sep 19, 2023
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF
- Publication number 20240113053
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AG
- Andreas Korzenietz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20230395539
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20220059477
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS