Julian G. Cempa

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Deposit, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Via and pad structure for thermoplastic substrates and method and a...
- Patent number 5,401,911
- Issue date Mar 28, 1995
- International Business Machines Corporation
- Herbert Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct transferring of electrically conductive elements i...
- Patent number 5,305,523
- Issue date Apr 26, 1994
- International Business Machines Corporation
- Arthur Bross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a high density connector system
- Patent number 5,276,964
- Issue date Jan 11, 1994
- International Business Machines Corporation
- Herbert R. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density connector system
- Patent number 5,205,738
- Issue date Apr 27, 1993
- International Business Machines Corporation
- Herbert R. Anderson
- H01 - BASIC ELECTRIC ELEMENTS