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Julie C. Biggs
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Wappingers Falls, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Forming robust solder interconnect structures by reducing effects o...
Patent number
7,767,575
Issue date
Aug 3, 2010
Tessera Intellectual Properties, Inc.
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a bond pad on an I/C chip and resulting structure
Patent number
7,572,726
Issue date
Aug 11, 2009
International Business Machines Corporation
Julie C. Biggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming robust solder interconnect structures by reducin...
Patent number
7,473,997
Issue date
Jan 6, 2009
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming robust solder interconnect structures by reducin...
Patent number
6,995,084
Issue date
Feb 7, 2006
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
I/C chip suitable for wire bonding
Patent number
6,995,475
Issue date
Feb 7, 2006
International Business Machines Corporation
Julie C. Biggs
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCING EFFECTS O...
Publication number
20090163019
Publication date
Jun 25, 2009
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
Publication number
20060081981
Publication date
Apr 20, 2006
International Business Machines Corporation
Julie C. Biggs
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
Publication number
20060009022
Publication date
Jan 12, 2006
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING ROBUST SOLDER INTERCONNECT STRUCTURES BY REDUCIN...
Publication number
20050208748
Publication date
Sep 22, 2005
International Business Machines Corporation
Kamalesh K. Srivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a bond pad on an I/C chip and resulting structure
Publication number
20050062170
Publication date
Mar 24, 2005
International Business Machines Corporation
Julie C. Biggs
H01 - BASIC ELECTRIC ELEMENTS