Julie Yang

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Film structure for bond pad
- Patent number 12,249,586
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film structure for bond pad
- Patent number 11,322,464
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20240387424
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20220254744
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20210098398
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS