Julien Jussot

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Kessel-Lo, BE

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Patents Grantslast 30 patents

Information Patent Grant
Method for processing a semiconductor device with two closely space...
- Patent number 11,638,391
- Issue date Apr 25, 2023
- Imec VZW
- Boon Teik Chan
Information Patent Grant
Method for bonding and interconnecting semiconductor chips
- Patent number 11,114,337
- Issue date Sep 7, 2021
- Imec VZW
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned internal spacer with EUV
- Patent number 10,903,335
- Issue date Jan 26, 2021
- Imec VZW
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Structure
- Publication number 20240204066
- Publication date Jun 20, 2024
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE WITH TWO CLOSELY SPACE...
- Publication number 20210391526
- Publication date Dec 16, 2021
- IMEC vzw
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING AND INTERCONNECTING SEMICONDUCTOR CHIPS
- Publication number 20200203224
- Publication date Jun 25, 2020
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Internal Spacer With EUV
- Publication number 20190348523
- Publication date Nov 14, 2019
- IMEC vzw
- Gaspard Hiblot
- H01 - BASIC ELECTRIC ELEMENTS