Jum Dong Lee

Follow

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die bonding apparatus having multiple bonding head units
- Patent number 7,896,051
- Issue date Mar 1, 2011
- Hynix Semiconductor Inc.
- Byung Chul Kang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE BONDING APPARATUS HAVING MULTIPLE BONDING HEAD UNITS
- Publication number 20090120589
- Publication date May 14, 2009
- Byung Chul Kang
- H01 - BASIC ELECTRIC ELEMENTS