Jun Chiba

Person

Kanzaki-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Noble metal-coated silver wire for ball bonding and method for prod...
- Patent number 11,456,271
- Issue date Sep 27, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding, and semiconductor...
- Patent number 11,251,153
- Issue date Feb 15, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for high-speed signal line
- Patent number 9,972,595
- Issue date May 15, 2018
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver—gold alloy bonding wire
- Patent number 9,362,249
- Issue date Jun 7, 2016
- Tanaka Denshi Kogyo K.K.
- Kazuhiko Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag—Au—Pd ternary alloy bonding wire
- Patent number 9,103,001
- Issue date Aug 11, 2015
- Tanaka Denshi Kogyo K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...
- Publication number 20210050321
- Publication date Feb 18, 2021
- Jun CHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...
- Publication number 20200395330
- Publication date Dec 17, 2020
- TANAKA DENSHI KOGYO K.K.
- Jun CHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER-GOLD ALLOY BONDING WIRE
- Publication number 20160093586
- Publication date Mar 31, 2016
- TANAKA DENSHI KOGYO K.K.
- Kazuhiko YASUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR HIGH-SPEED SIGNAL LINE
- Publication number 20140302317
- Publication date Oct 9, 2014
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ag-Au-Pd TERNARY ALLOY BONDING WIRE
- Publication number 20120263624
- Publication date Oct 18, 2012
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE
- Publication number 20110058979
- Publication date Mar 10, 2011
- TANAKA DENSHI KOGYO K.K.
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF...
- Publication number 20100171222
- Publication date Jul 8, 2010
- TANAKA DENSHI KOGYO K.K.
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Au Alloy Bonding Wire
- Publication number 20080050267
- Publication date Feb 28, 2008
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Noble metal-coated silver wire for ball bonding and method for prod...

Noble metal-coated silver wire for ball bonding, and semiconductor...

Bonding wire for high-speed signal line

Silver—gold alloy bonding wire

Ag—Au—Pd ternary alloy bonding wire

Patents Applicationslast 30 patents

NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...

NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...

SILVER-GOLD ALLOY BONDING WIRE

BONDING WIRE FOR HIGH-SPEED SIGNAL LINE

Ag-Au-Pd TERNARY ALLOY BONDING WIRE

BONDING WIRE

HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF...

Au Alloy Bonding Wire