Jun Chung Hsu

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Asymmetric stackup structure for SoC package substrates
- Patent number 11,862,597
- Issue date Jan 2, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less integrated components
- Patent number 10,991,659
- Issue date Apr 27, 2021
- Apple Inc.
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less integrated components
- Patent number 10,535,611
- Issue date Jan 14, 2020
- Apple Inc.
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects for self shielded system in package (SiP) mo...
- Patent number 10,522,475
- Issue date Dec 31, 2019
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects for self shielded system in package (SiP) mo...
- Patent number 10,115,677
- Issue date Oct 30, 2018
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self shielded system in package (SiP) modules
- Patent number 10,109,593
- Issue date Oct 23, 2018
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnects for self shielded system in package (SiP) mo...
- Patent number 9,721,903
- Issue date Aug 1, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra fine pitch PoP coreless package
- Patent number 9,570,367
- Issue date Feb 14, 2017
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra fine pitch PoP coreless package
- Patent number 9,305,853
- Issue date Apr 5, 2016
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
- Publication number 20240162182
- Publication date May 16, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Embedded Redistribution Layers for IC Substrate Packaging
- Publication number 20230402390
- Publication date Dec 14, 2023
- Apple Inc.
- Ryan Mesch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric Stackup Structure for SoC Package Substrates
- Publication number 20230092505
- Publication date Mar 23, 2023
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Trace Morphology Structure for High Speed Applications
- Publication number 20220336342
- Publication date Oct 20, 2022
- Apple Inc.
- Zheng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS INTEGRATED COMPONENTS
- Publication number 20200144142
- Publication date May 7, 2020
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...
- Publication number 20190027445
- Publication date Jan 24, 2019
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...
- Publication number 20170301631
- Publication date Oct 19, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SIP) MO...
- Publication number 20170179039
- Publication date Jun 22, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS INTEGRATED COMPONENTS
- Publication number 20170148744
- Publication date May 25, 2017
- Apple Inc.
- Flynn P. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF SHIELDED SYSTEM IN PACKAGE (SiP) MODULES
- Publication number 20170025361
- Publication date Jan 26, 2017
- Apple Inc.
- Meng Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA FINE PITCH PoP CORELESS PACKAGE
- Publication number 20160172261
- Publication date Jun 16, 2016
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL STRUCTURE ACHIEVING FINE THROUGH HOLE PITCH FOR INTEGRATED CI...
- Publication number 20150230342
- Publication date Aug 13, 2015
- Apple Inc.
- Jun Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA FINE PITCH PoP CORELESS PACKAGE
- Publication number 20150061142
- Publication date Mar 5, 2015
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Jun Chung Hsu

Person

Patents Grantslast 30 patents

Asymmetric stackup structure for SoC package substrates

Substrate-less integrated components

Substrate-less integrated components

Vertical interconnects for self shielded system in package (SiP) mo...

Vertical interconnects for self shielded system in package (SiP) mo...

Self shielded system in package (SiP) modules

Vertical interconnects for self shielded system in package (SiP) mo...

Ultra fine pitch PoP coreless package

Ultra fine pitch PoP coreless package

Patents Applicationslast 30 patents

Asymmetric Stackup Structure for SoC Package Substrates

3D Embedded Redistribution Layers for IC Substrate Packaging

Asymmetric Stackup Structure for SoC Package Substrates

Wiring Trace Morphology Structure for High Speed Applications

SUBSTRATE-LESS INTEGRATED COMPONENTS

VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...

VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SiP) MO...

VERTICAL INTERCONNECTS FOR SELF SHIELDED SYSTEM IN PACKAGE (SIP) MO...

SUBSTRATE-LESS INTEGRATED COMPONENTS

SELF SHIELDED SYSTEM IN PACKAGE (SiP) MODULES

ULTRA FINE PITCH PoP CORELESS PACKAGE

NOVEL STRUCTURE ACHIEVING FINE THROUGH HOLE PITCH FOR INTEGRATED CI...

ULTRA FINE PITCH PoP CORELESS PACKAGE