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Jun Dai

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  • Hebei, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Buried thermistor and method of fabricating the same
    • Patent number 12,191,056
    • Issue date Jan 7, 2025
    • HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
    • Jian Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit board and method of manufacturing circuit board
    • Patent number 11,871,526
    • Issue date Jan 9, 2024
    • HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    • Jun Dai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for manufacturing circuit board
    • Patent number 11,294,285
    • Issue date Apr 5, 2022
    • HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    • Xian-Qin Hu
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Circuit board and method of manufacturing circuit board
    • Patent number 11,291,126
    • Issue date Mar 29, 2022
    • HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    • Jun Dai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for manufacturing circuit board
    • Patent number 10,653,011
    • Issue date May 12, 2020
    • HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    • Xian-Qin Hu
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    BURIED THERMISTOR AND METHOD OF FABRICATING THE SAME
    • Publication number 20230377779
    • Publication date Nov 23, 2023
    • HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
    • Jian WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAMERA MODULE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20220191361
    • Publication date Jun 16, 2022
    • QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
    • Jun Dai
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
    • Publication number 20220174822
    • Publication date Jun 2, 2022
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • JUN DAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
    • Publication number 20220030724
    • Publication date Jan 27, 2022
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • JUN DAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING CIRCUIT BOARD
    • Publication number 20200236783
    • Publication date Jul 23, 2020
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • XIAN-QIN HU
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR MANUFACTURING CIRCUIT BOARD
    • Publication number 20190116676
    • Publication date Apr 18, 2019
    • HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    • XIAN-QIN HU
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...