Jun Guo

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Bandgap reference circuit for reducing power consumption and method...
- Patent number 10,671,108
- Issue date Jun 2, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Josh Yang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Level-shifter circuits and methods of using the same
- Patent number 10,469,086
- Issue date Nov 5, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chia Chi Yang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip scale package fabrication methods
- Patent number 7,745,261
- Issue date Jun 29, 2010
- Shanghai Kaihong Technology Co., Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded chip scale package fabrication methods
- Patent number 7,517,726
- Issue date Apr 14, 2009
- Shanghai KaiHong Technology Co., Ltd
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DETECTING CLARITY OF THYROID NODULE BOUNDARY, SYSTEM THE...
- Publication number 20250095827
- Publication date Mar 20, 2025
- TenD.AI Medical Technology (Shanghai) Co., Ltd.
- Jun GUO
Information Patent Application
LEVEL-SHIFTER CIRCUITS AND METHODS OF USING THE SAME
- Publication number 20180205379
- Publication date Jul 19, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chia Chi YANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BANDGAP REFERENCE CIRCUIT AND METHOD OF USING THE SAME
- Publication number 20180129237
- Publication date May 10, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Josh YANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Chip Scale Package Fabrication Methods
- Publication number 20090215227
- Publication date Aug 27, 2009
- Shanghai KaiHong Technology Co., Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS