Jun He

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of determining stress
- Patent number 7,568,396
- Issue date Aug 4, 2009
- Hewlett-Packard Development Company, L.P.
- Jun He
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION OBTAINING METHOD, DEVICE, AND SYSTEM
- Publication number 20250225327
- Publication date Jul 10, 2025
- Huawei Technologies Co., Ltd
- Kun CAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method Of Determining Stress
- Publication number 20070056381
- Publication date Mar 15, 2007
- Jun He
- G01 - MEASURING TESTING
Information Patent Application
Micromachined wafer strain gauge
- Publication number 20060030062
- Publication date Feb 9, 2006
- Jun He
- G01 - MEASURING TESTING