Jun He

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 9,984,922
- Issue date May 29, 2018
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debond interconnect structures
- Patent number 9,461,010
- Issue date Oct 4, 2016
- Intel Corporation
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 9,437,545
- Issue date Sep 6, 2016
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debond interconnect structures
- Patent number 9,269,686
- Issue date Feb 23, 2016
- Intel Corporation
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 8,928,125
- Issue date Jan 6, 2015
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of on-die redistribution interconnects from scrib...
- Patent number 8,704,336
- Issue date Apr 22, 2014
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debond interconnect structures
- Patent number 8,637,778
- Issue date Jan 28, 2014
- Intel Corporation
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming electromigration and thermal gradient based fuse...
- Patent number 8,368,171
- Issue date Feb 5, 2013
- Intel Corporation
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse programming schemes for robust yield
- Patent number 8,331,186
- Issue date Dec 11, 2012
- Intel Corporation
- Jun He
- G11 - INFORMATION STORAGE
Information Patent Grant
Tamper resistant fuse design
- Patent number 8,242,831
- Issue date Aug 14, 2012
- Intel Corporation
- Xianghong Tong
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 8,058,710
- Issue date Nov 15, 2011
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse programming schemes for robust yield
- Patent number 7,889,587
- Issue date Feb 15, 2011
- Intel Corporation
- Jun He
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic die having CMOS ring oscillator thereon and method...
- Patent number 7,889,013
- Issue date Feb 15, 2011
- Intel Corporation
- Gerald S. Leatherman
- G01 - MEASURING TESTING
Information Patent Grant
Transistor performance enhancement using engineered strains
- Patent number 7,679,145
- Issue date Mar 16, 2010
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electromigration and thermal gradient based fuse...
- Patent number 7,662,674
- Issue date Feb 16, 2010
- Intel Corporation
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect shunt used for current distribution and reliability re...
- Patent number 7,524,754
- Issue date Apr 28, 2009
- Intel Corporation
- Mark Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having sealing structures to enable selective metal c...
- Patent number 7,402,519
- Issue date Jul 22, 2008
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming self-passivating interconnects and resulting devices
- Patent number 7,402,509
- Issue date Jul 22, 2008
- Intel Corporation
- Mauro J. Kobrinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanically robust dielectric film and stack
- Patent number 7,348,283
- Issue date Mar 25, 2008
- Intel Corporation
- Jihperng Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect shunt used for current distribution and reliability re...
- Patent number 7,208,830
- Issue date Apr 24, 2007
- Intel Corporation
- Mark Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically robust interconnect for low-k dielectric material usin...
- Patent number 7,175,970
- Issue date Feb 13, 2007
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for an integrated circuit and method of fabr...
- Patent number 7,151,051
- Issue date Dec 19, 2006
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge arrangements for integrated circuit chips
- Patent number 7,087,452
- Issue date Aug 8, 2006
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress mitigation layer to reduce under bump stress concentration
- Patent number 7,071,554
- Issue date Jul 4, 2006
- Intel Corporation
- Makarem A. Hussein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically robust interconnect for low-k dielectric material usin...
- Patent number 6,998,216
- Issue date Feb 14, 2006
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for an integrated circuit and method of fabr...
- Patent number 6,919,637
- Issue date Jul 19, 2005
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming defect prevention trenches in dicing streets
- Patent number 6,838,299
- Issue date Jan 4, 2005
- Intel Corporation
- Rose A. Mulligan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...
- Publication number 20160372366
- Publication date Dec 22, 2016
- Intel Corporation
- Jun HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBOND INTERCONNECT STRUCTURES
- Publication number 20160133596
- Publication date May 12, 2016
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...
- Publication number 20150097292
- Publication date Apr 9, 2015
- Intel Corporation
- Jun HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBOND INTERCONNECT STRUCTURES
- Publication number 20140106560
- Publication date Apr 17, 2014
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...
- Publication number 20120007242
- Publication date Jan 12, 2012
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBOND INTERCONNECT STRUCTURES
- Publication number 20110247872
- Publication date Oct 13, 2011
- Qing Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER RESISTANT FUSE DESIGN
- Publication number 20110156801
- Publication date Jun 30, 2011
- Xianghong Tong
- G11 - INFORMATION STORAGE
Information Patent Application
NOVEL FUSE PROGRAMMING SCHEMES FOR ROBUST YIELD
- Publication number 20110103170
- Publication date May 5, 2011
- Intel Corporation
- Jun He
- G11 - INFORMATION STORAGE
Information Patent Application
SELECTIVE REMOVAL OF ON-DIE REDISTRIBUTION INTERCONNECTS FROM SCRIB...
- Publication number 20090057842
- Publication date Mar 5, 2009
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Die Having CMOS Ring Oscillator Thereon And Method...
- Publication number 20090058540
- Publication date Mar 5, 2009
- Gerald S. Leatherman
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Apparatus and method for detection of edge damages
- Publication number 20080203388
- Publication date Aug 28, 2008
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects having sealing structures to enable selective metal c...
- Publication number 20080179748
- Publication date Jul 31, 2008
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel fuse programming schemes for robust yield
- Publication number 20080136496
- Publication date Jun 12, 2008
- Jun He
- G11 - INFORMATION STORAGE
Information Patent Application
Systems and methods to passivate on-die redistribution interconnects
- Publication number 20080122078
- Publication date May 29, 2008
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing interconnect line to line capacitance by using a...
- Publication number 20070238309
- Publication date Oct 11, 2007
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standby circuitry for fuse cell
- Publication number 20070217248
- Publication date Sep 20, 2007
- Zhanping Chen
- G11 - INFORMATION STORAGE
Information Patent Application
Methods of forming electromigration and thermal gradient based fuse...
- Publication number 20070069331
- Publication date Mar 29, 2007
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects having sealing structures to enable selective metal c...
- Publication number 20060273431
- Publication date Dec 7, 2006
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming electromigration and thermal gradient based fuse...
- Publication number 20060261437
- Publication date Nov 23, 2006
- Jose A. Maiz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming self-passivating interconnects and resulting devices
- Publication number 20060220197
- Publication date Oct 5, 2006
- Mauro J. Kobrinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mechanically robust dielectric film and stack
- Publication number 20060138665
- Publication date Jun 29, 2006
- Jihperng Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect shunt used for current distribution and reliability re...
- Publication number 20060097375
- Publication date May 11, 2006
- Mark Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanically robust interconnect for low-k dielectric material usin...
- Publication number 20060073416
- Publication date Apr 6, 2006
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor performance enhancement using engineered strains
- Publication number 20060043579
- Publication date Mar 2, 2006
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect shunt used for current distribution and reliability re...
- Publication number 20060001178
- Publication date Jan 5, 2006
- Mark Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress mitigation layer to reduce under bump stress concentration
- Publication number 20050275095
- Publication date Dec 15, 2005
- Makarem A. Hussein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structure for an integrated circuit and method of fabr...
- Publication number 20050221604
- Publication date Oct 6, 2005
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge arrangements for integrated circuit chips
- Publication number 20040212047
- Publication date Oct 28, 2004
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structure for an integrated circuit and method of fabr...
- Publication number 20040061231
- Publication date Apr 1, 2004
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanically robust interconnect for low-k dielectric material usin...
- Publication number 20040058277
- Publication date Mar 25, 2004
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Interconnects having sealing structures to enable selective metal c...

Debond interconnect structures

Interconnects having sealing structures to enable selective metal c...

Debond interconnect structures

Interconnects having sealing structures to enable selective metal c...

Selective removal of on-die redistribution interconnects from scrib...

Debond interconnect structures

Methods of forming electromigration and thermal gradient based fuse...

Fuse programming schemes for robust yield

Tamper resistant fuse design

Interconnects having sealing structures to enable selective metal c...

Fuse programming schemes for robust yield

Microelectronic die having CMOS ring oscillator thereon and method...

Transistor performance enhancement using engineered strains

Methods of forming electromigration and thermal gradient based fuse...

Interconnect shunt used for current distribution and reliability re...

Interconnects having sealing structures to enable selective metal c...

Method of forming self-passivating interconnects and resulting devices

Mechanically robust dielectric film and stack

Interconnect shunt used for current distribution and reliability re...

Mechanically robust interconnect for low-k dielectric material usin...

Interconnect structure for an integrated circuit and method of fabr...

Edge arrangements for integrated circuit chips

Stress mitigation layer to reduce under bump stress concentration

Mechanically robust interconnect for low-k dielectric material usin...

Interconnect structure for an integrated circuit and method of fabr...

Forming defect prevention trenches in dicing streets

Patents Applicationslast 30 patents

INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...

DEBOND INTERCONNECT STRUCTURES

INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...

DEBOND INTERCONNECT STRUCTURES

INTERCONNECTS HAVING SEALING STRUCTURES TO ENABLE SELECTIVE METAL C...

DEBOND INTERCONNECT STRUCTURES

TAMPER RESISTANT FUSE DESIGN

NOVEL FUSE PROGRAMMING SCHEMES FOR ROBUST YIELD

SELECTIVE REMOVAL OF ON-DIE REDISTRIBUTION INTERCONNECTS FROM SCRIB...

Microelectronic Die Having CMOS Ring Oscillator Thereon And Method...

Apparatus and method for detection of edge damages

Interconnects having sealing structures to enable selective metal c...

Novel fuse programming schemes for robust yield

Systems and methods to passivate on-die redistribution interconnects

Method of reducing interconnect line to line capacitance by using a...

Standby circuitry for fuse cell

Methods of forming electromigration and thermal gradient based fuse...

Interconnects having sealing structures to enable selective metal c...

Methods of forming electromigration and thermal gradient based fuse...

Method of forming self-passivating interconnects and resulting devices

Mechanically robust dielectric film and stack

Interconnect shunt used for current distribution and reliability re...

Mechanically robust interconnect for low-k dielectric material usin...

Transistor performance enhancement using engineered strains

Interconnect shunt used for current distribution and reliability re...

Stress mitigation layer to reduce under bump stress concentration

Interconnect structure for an integrated circuit and method of fabr...

Edge arrangements for integrated circuit chips

Interconnect structure for an integrated circuit and method of fabr...

Mechanically robust interconnect for low-k dielectric material usin...