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Jun Higuchi

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  • Kanagawa, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for copper plating
    • Patent number 9,506,158
    • Issue date Nov 29, 2016
    • Atotech Deutschland GmbH
    • Dirk Rohde
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR COPPER PLATING
    • Publication number 20140102910
    • Publication date Apr 17, 2014
    • Atotech Deutschland GmbH
    • Dirk Rohde
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR