Jun Ho Won

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Wide-angle emission filter, optical sensor assembly having the same...
- Patent number 10,962,477
- Issue date Mar 30, 2021
- OPTOLANE TECHNOLOGIES INC.
- Jun Ho Won
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Image sensor using backside illumination photodiode and method for...
- Patent number 9,553,120
- Issue date Jan 24, 2017
- SILICONFILE TECHNOLOGIES INC.
- Jae Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor including infrared pixels having improved spectra...
- Patent number 9,484,377
- Issue date Nov 1, 2016
- SILICONFILE TECHNOLOGIES INC.
- Jun Ho Won
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for forming pad in wafer with three-dimensional stacking str...
- Patent number 8,993,411
- Issue date Mar 31, 2015
- Siliconfile Technologies Inc.
- Heui-Gyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having wave guide and method for manufacturing the same
- Patent number 8,816,459
- Issue date Aug 26, 2014
- Siliconfile Technologies Inc.
- In-Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illumination image sensor reduced in size and method for...
- Patent number 8,421,134
- Issue date Apr 16, 2013
- Siliconfile Technologies Inc.
- In Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illumination image sensor reduced in size and method for...
- Patent number 8,420,429
- Issue date Apr 16, 2013
- Siliconfile Technologies Inc.
- In Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming pad in wafer with three-dimensional stacking str...
- Patent number 8,399,282
- Issue date Mar 19, 2013
- Siliconfile Technologies Inc.
- Heui Gyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having wave guide and method for manufacturing the same
- Patent number 8,368,158
- Issue date Feb 5, 2013
- Siliconfile Technologies Inc.
- In-Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having anti-reflection film for reducing crosstalk
- Patent number 7,898,011
- Issue date Mar 1, 2011
- Siliconfile Technologies Inc.
- Jun Ho Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor using back-illuminated photodiode and method of manufa...
- Patent number 7,714,403
- Issue date May 11, 2010
- Siliconfile Technologies Inc.
- Byoung Su Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIDE-ANGLE EMISSION FILTER, OPTICAL SENSOR ASSEMBLY HAVING THE SAME...
- Publication number 20180156731
- Publication date Jun 7, 2018
- OPTOLANE Technologies Inc.
- Jun Ho Won
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
IMAGE SENSOR HAVING IMPROVED SPECTRAL CHARACTERISTICS
- Publication number 20170237911
- Publication date Aug 17, 2017
- SILICONFILE TECHNOLOGIES INC.
- Jun-Ho WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SEPARATION-TYPE THREE-DIMENSIONAL CHIP STACKING IMAGE SEN...
- Publication number 20160300875
- Publication date Oct 13, 2016
- SILICONFILE TECHNOLOGIES INC.
- Jun Ho WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR INCLUDING COLOR MICROLENS, AND METHOD FOR MANUFAC...
- Publication number 20150325618
- Publication date Nov 12, 2015
- SiliconFile Technologies Inc.
- Heui Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR INCLUDING INFRARED PIXELS HAVING IMPROVED SPECTRA...
- Publication number 20150311239
- Publication date Oct 29, 2015
- SiliconFile Technologies Inc.
- Jun Ho WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED IMAGE SENSOR HAVING HETEROGENEOUS JUNCTION STRUCTURE A...
- Publication number 20150155323
- Publication date Jun 4, 2015
- SiliconFile Technologies Inc.
- Heui Gyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR USING BACKSIDE ILLUMINATION PHOTODIODE AND METHOD FOR...
- Publication number 20150115330
- Publication date Apr 30, 2015
- SILICONFILE TECHNOLOGIES INC.
- Jae Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STR...
- Publication number 20130189828
- Publication date Jul 25, 2013
- Siliconfile Technologies Inc.
- Heui-Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATION IMAGE SENSOR REDUCED IN SIZE AND METHOD FOR...
- Publication number 20120301996
- Publication date Nov 29, 2012
- Siliconfile Technologies Inc.
- In-Gyun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING WAVE GUIDE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120295389
- Publication date Nov 22, 2012
- Siliconfile Technologies Inc.
- In-Gyun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STR...
- Publication number 20110207258
- Publication date Aug 25, 2011
- Siliconfile Technologies Inc.
- Heui-Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATION IMAGE SENSOR REDUCED IN SIZE AND METHOD FOR...
- Publication number 20110156113
- Publication date Jun 30, 2011
- Siliconfile Technologies Inc.
- In-Gyun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING WAVE GUIDE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100264504
- Publication date Oct 21, 2010
- Siliconfile Technologies Inc.
- In-Gyun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR USING BACK-ILLUMINATED PHOTODIODE AND METHOD OF MANUFA...
- Publication number 20090224345
- Publication date Sep 10, 2009
- Siliconfile Technologies Inc.
- Byoung Su Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS STEREO CAMERA FOR OBTAINING THREE-DIMENSIONAL IMAGE
- Publication number 20090058993
- Publication date Mar 5, 2009
- Siliconfile Technologies Inc.
- Byoung Su Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image Sensor Having Anti-Reflection Film and Method of Manufacturin...
- Publication number 20090008737
- Publication date Jan 8, 2009
- Siliconfile Technologies Inc.
- Jun Ho Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor with Color Filters and Method of Manufacturing the Same
- Publication number 20080296713
- Publication date Dec 4, 2008
- Byoung Su Lee
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wide-angle emission filter, optical sensor assembly having the same...

Image sensor using backside illumination photodiode and method for...

CMOS image sensor including infrared pixels having improved spectra...

Method for forming pad in wafer with three-dimensional stacking str...

Image sensor having wave guide and method for manufacturing the same

Back side illumination image sensor reduced in size and method for...

Back side illumination image sensor reduced in size and method for...

Method for forming pad in wafer with three-dimensional stacking str...

Image sensor having wave guide and method for manufacturing the same

Image sensor having anti-reflection film for reducing crosstalk

Image sensor using back-illuminated photodiode and method of manufa...

Patents Applicationslast 30 patents

WIDE-ANGLE EMISSION FILTER, OPTICAL SENSOR ASSEMBLY HAVING THE SAME...

IMAGE SENSOR HAVING IMPROVED SPECTRAL CHARACTERISTICS

SUBSTRATE SEPARATION-TYPE THREE-DIMENSIONAL CHIP STACKING IMAGE SEN...

CMOS IMAGE SENSOR INCLUDING COLOR MICROLENS, AND METHOD FOR MANUFAC...

CMOS IMAGE SENSOR INCLUDING INFRARED PIXELS HAVING IMPROVED SPECTRA...

CHIP-STACKED IMAGE SENSOR HAVING HETEROGENEOUS JUNCTION STRUCTURE A...

IMAGE SENSOR USING BACKSIDE ILLUMINATION PHOTODIODE AND METHOD FOR...

METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STR...

BACK SIDE ILLUMINATION IMAGE SENSOR REDUCED IN SIZE AND METHOD FOR...

IMAGE SENSOR HAVING WAVE GUIDE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STR...

BACK SIDE ILLUMINATION IMAGE SENSOR REDUCED IN SIZE AND METHOD FOR...

IMAGE SENSOR HAVING WAVE GUIDE AND METHOD FOR MANUFACTURING THE SAME

IMAGE SENSOR USING BACK-ILLUMINATED PHOTODIODE AND METHOD OF MANUFA...

CMOS STEREO CAMERA FOR OBTAINING THREE-DIMENSIONAL IMAGE

Image Sensor Having Anti-Reflection Film and Method of Manufacturin...

Image Sensor with Color Filters and Method of Manufacturing the Same