Jun Hyuk Kwon

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method
- Patent number 11,875,998
- Issue date Jan 16, 2024
- Wonik IPS Co., Ltd.
- Kwang Seon Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for atomic layer etching
- Patent number 11,784,029
- Issue date Oct 10, 2023
- Wonik IPS Co., Ltd.
- Kwang Seon Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching method
- Patent number 11,450,531
- Issue date Sep 20, 2022
- Wonik IPS Co., Ltd.
- Jun Hyuck Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floor panel having adhesive applied sheet
- Patent number 9,657,482
- Issue date May 23, 2017
- LG Hausys, Ltd.
- Hae Seung Ko
- E04 - BUILDING
Information Patent Grant
Chip through flooring material using PLA resin
- Patent number 9,623,635
- Issue date Apr 18, 2017
- LG Hausys, Ltd.
- Cheng-Zhe Huang
- E04 - BUILDING
Information Patent Grant
Floor material using PLA resin
- Patent number 9,517,612
- Issue date Dec 13, 2016
- LG Hausys, Ltd.
- Cheng-Zhe Huang
- E04 - BUILDING
Information Patent Grant
Chip-inlaid flooring material using PLA resin
- Patent number 9,422,729
- Issue date Aug 23, 2016
- LG Hausys, Ltd.
- Hyun-Jong Kwon
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR ATOMIC LAYER ETCHING
- Publication number 20220059325
- Publication date Feb 24, 2022
- WONIK IPS CO., LTD.
- Kwang Seon JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20210193472
- Publication date Jun 24, 2021
- WONIK IPS CO., LTD.
- Kwang Seon JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING METHOD
- Publication number 20210193473
- Publication date Jun 24, 2021
- WONIK IPS CO., LTD.
- Jun Hyuck KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOOR PANEL HAVING ADHESIVE APPLIED SHEET
- Publication number 20150044409
- Publication date Feb 12, 2015
- LG HAUSYS, LTD.
- Hae Seung Ko
- E04 - BUILDING
Information Patent Application
FLOORING MATERIAL USING POLY LACTIC ACID RESIN AND CONSTRUCTION MET...
- Publication number 20140370225
- Publication date Dec 18, 2014
- Hae Seung Ko
- E04 - BUILDING
Information Patent Application
FLOORING USING PVC AND METHOD OF CONSTRUCTING THE FLOORING
- Publication number 20140360117
- Publication date Dec 11, 2014
- LG Hausys, Ltd.
- Hae Seung Ko
- E04 - BUILDING
Information Patent Application
CHIP-INLAID FLOORING MATERIAL USING PLA RESIN
- Publication number 20130302577
- Publication date Nov 14, 2013
- LG HAUSYS, LTD.
- Hyun-Jong Kwon
- B32 - LAYERED PRODUCTS
Information Patent Application
BOARD COMPLEX HAVING PLA COVER
- Publication number 20130004703
- Publication date Jan 3, 2013
- LG HAUSYS, LTD.
- Hyun-Jong Kwon
- B32 - LAYERED PRODUCTS
Information Patent Application
FLOOR MATERIAL USING PLA RESIN
- Publication number 20130004751
- Publication date Jan 3, 2013
- LG HAUSYS, LTD.
- Cheng-Zhe Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP THROUGH FLOORING MATERIAL USING PLA RESIN
- Publication number 20120231256
- Publication date Sep 13, 2012
- LG HAUSYS, LTD.
- Cheng-Zhe Huang
- B32 - LAYERED PRODUCTS

Jun Hyuk Kwon

Person

Patents Grantslast 30 patents

Substrate processing method

Method and apparatus for atomic layer etching

Atomic layer etching method

Floor panel having adhesive applied sheet

Chip through flooring material using PLA resin

Floor material using PLA resin

Chip-inlaid flooring material using PLA resin

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR ATOMIC LAYER ETCHING

SUBSTRATE PROCESSING METHOD

ATOMIC LAYER ETCHING METHOD

FLOOR PANEL HAVING ADHESIVE APPLIED SHEET

FLOORING MATERIAL USING POLY LACTIC ACID RESIN AND CONSTRUCTION MET...

FLOORING USING PVC AND METHOD OF CONSTRUCTING THE FLOORING

CHIP-INLAID FLOORING MATERIAL USING PLA RESIN

BOARD COMPLEX HAVING PLA COVER

FLOOR MATERIAL USING PLA RESIN

CHIP THROUGH FLOORING MATERIAL USING PLA RESIN