Jun Ishii

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board assembly sheet and method for manufacturing t...
- Patent number 10,420,224
- Issue date Sep 17, 2019
- Nitto Denko Corporation
- Jun Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sealing sheet
- Patent number 10,074,582
- Issue date Sep 11, 2018
- Nitto Denko Corporation
- Jun Ishii
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Printed circuit board, method of manufacturing the same and connect...
- Patent number 9,894,774
- Issue date Feb 13, 2018
- Nitto Denko Corporation
- Yoshito Fujimura
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermally curable resin sheet for sealing semiconductor chip, and m...
- Patent number 9,659,883
- Issue date May 23, 2017
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a printed circuit board assembly sheet
- Patent number 9,642,262
- Issue date May 2, 2017
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Suspension board assembly sheet with circuits and method for manufa...
- Patent number 9,451,704
- Issue date Sep 20, 2016
- Nitto Denko Corporation
- Terukazu Ihara
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board, method of manufacturing the same and connect...
- Patent number 9,337,559
- Issue date May 10, 2016
- Nitto Denko Corporation
- Yoshito Fujimura
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board
- Patent number 9,295,156
- Issue date Mar 22, 2016
- Nitto Denko Corporation
- Kouji Ichinose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 9,253,879
- Issue date Feb 2, 2016
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 9,241,410
- Issue date Jan 19, 2016
- Nitto Denko Corporation
- Saori Ishigaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Suspension board with circuit
- Patent number 9,183,879
- Issue date Nov 10, 2015
- Nitto Denko Corporation
- Yoshito Fujimura
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board including an insulating layer formed with an op...
- Patent number 9,018,540
- Issue date Apr 28, 2015
- Nitto Denko Corporation
- Jun Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board, method for manufact...
- Patent number 8,866,020
- Issue date Oct 21, 2014
- Nitto Denko Corporation
- Jun Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a suspension board with circuit
- Patent number 8,858,810
- Issue date Oct 14, 2014
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 8,802,994
- Issue date Aug 12, 2014
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Suspension board with circuit
- Patent number 8,797,831
- Issue date Aug 5, 2014
- Nitto Denko Corporation
- Yoshito Fujimura
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board
- Patent number 8,760,815
- Issue date Jun 24, 2014
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 8,692,126
- Issue date Apr 8, 2014
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board
- Patent number 8,669,479
- Issue date Mar 11, 2014
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board assembly sheet and method for manufacturing t...
- Patent number 8,658,906
- Issue date Feb 25, 2014
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Suspension board with circuit having an opening formed in the metal...
- Patent number 8,520,343
- Issue date Aug 27, 2013
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Producing method of wired circuit board
- Patent number 8,460,563
- Issue date Jun 11, 2013
- Nitto Denko Corporation
- Jun Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit and producing method thereof
- Patent number 8,351,743
- Issue date Jan 8, 2013
- Nitto Denko Corporation
- Toshiki Naito
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 8,327,535
- Issue date Dec 11, 2012
- Nitto Denko Corporation
- Yasunari Ooyabu
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board and connection structure between wired circuit...
- Patent number 8,314,338
- Issue date Nov 20, 2012
- Nitto Denko Corporation
- Jun Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a wired circuit board
- Patent number 8,266,794
- Issue date Sep 18, 2012
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board
- Patent number 8,247,700
- Issue date Aug 21, 2012
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 8,227,705
- Issue date Jul 24, 2012
- Nitto Denko Corporation
- Tetsuya Ohsawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit
- Patent number 8,184,931
- Issue date May 22, 2012
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 8,164,002
- Issue date Apr 24, 2012
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEALING SHEET
- Publication number 20170287800
- Publication date Oct 5, 2017
- NITTO DENKO CORPORATION
- Jun Ishii
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEALING SHEET, SEALING SHEET WITH SEPARATOR, SEMICONDUCTOR DEVICE,...
- Publication number 20170278716
- Publication date Sep 28, 2017
- NITTO DENKO CORPORATION
- Chie Iino
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING T...
- Publication number 20170257954
- Publication date Sep 7, 2017
- Nitto Denko Corporation
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20170125373
- Publication date May 4, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170033076
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170032979
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND CONNECT...
- Publication number 20160219716
- Publication date Jul 28, 2016
- Nitto Denko Corporation
- Yoshito FUJIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...
- Publication number 20160211228
- Publication date Jul 21, 2016
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20160081185
- Publication date Mar 17, 2016
- Nitto Denko Corporation
- Jun ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEALING SHEET, METHOD FOR MANUFACTURING SEALING SHEET, AND METHOD F...
- Publication number 20160060450
- Publication date Mar 3, 2016
- NITTO DENKO CORPORATION
- Eiji Toyoda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20140353007
- Publication date Dec 4, 2014
- Nitto Denko Corporation
- Kouji ICHINOSE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT
- Publication number 20140153373
- Publication date Jun 5, 2014
- Nitto Denko Corporation
- Yoshito FUJIMURA
- G11 - INFORMATION STORAGE
Information Patent Application
SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFA...
- Publication number 20140126169
- Publication date May 8, 2014
- Nitto Denko Corporation
- Terukazu IHARA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20140101934
- Publication date Apr 17, 2014
- Nitto Denko Corporation
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20140048311
- Publication date Feb 20, 2014
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20130319743
- Publication date Dec 5, 2013
- Nitto Denko Corporation
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20130319748
- Publication date Dec 5, 2013
- Nitto Denko Corporation
- Jun ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING A SUSPENSION BOARD WITH CIRCUIT
- Publication number 20130299451
- Publication date Nov 14, 2013
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT
- Publication number 20130215726
- Publication date Aug 22, 2013
- Nitto Denko Corporation
- Yoshito FUJIMURA
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND CONNECT...
- Publication number 20130203294
- Publication date Aug 8, 2013
- Nitto Denko Corporation
- Yoshito FUJIMURA
- G11 - INFORMATION STORAGE
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20130133939
- Publication date May 30, 2013
- Nitto Denko Corporation
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20130014976
- Publication date Jan 17, 2013
- Nitto Denko Corporation
- Saori ISHIGAKI
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120279757
- Publication date Nov 8, 2012
- Nitto Denko Corporation
- Jun ISHII
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD FOR MANUFACT...
- Publication number 20120152592
- Publication date Jun 21, 2012
- Nitto Denko Corporation
- Jun ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board and producing method thereof
- Publication number 20120030939
- Publication date Feb 9, 2012
- Nitto Denko Corporation
- Yasunari Ooyabu
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING T...
- Publication number 20120033395
- Publication date Feb 9, 2012
- Nitto Denko Corporation
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
Suspension board with circuit and producing method thereof
- Publication number 20110286132
- Publication date Nov 24, 2011
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Application
Wired circuit board and producing method thereof
- Publication number 20110048785
- Publication date Mar 3, 2011
- Nitto Denko Corporation
- Jun Ishii
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD FOR BODY FLUID COLLECTION
- Publication number 20100292610
- Publication date Nov 18, 2010
- Jun Ishii
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Wired circuit board and production method thereof
- Publication number 20100186227
- Publication date Jul 29, 2010
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE

Person

Patents Grantslast 30 patents

Printed circuit board assembly sheet and method for manufacturing t...

Sealing sheet

Printed circuit board, method of manufacturing the same and connect...

Thermally curable resin sheet for sealing semiconductor chip, and m...

Method of manufacturing a printed circuit board assembly sheet

Suspension board assembly sheet with circuits and method for manufa...

Printed circuit board, method of manufacturing the same and connect...

Wired circuit board

Wired circuit board and producing method thereof

Wired circuit board and producing method thereof

Suspension board with circuit

Wired circuit board including an insulating layer formed with an op...

Method for manufacturing printed circuit board, method for manufact...

Method of producing a suspension board with circuit

Printed circuit board and method of manufacturing the same

Suspension board with circuit

Wired circuit board

Wired circuit board and producing method thereof

Wired circuit board

Printed circuit board assembly sheet and method for manufacturing t...

Suspension board with circuit having an opening formed in the metal...

Producing method of wired circuit board

Suspension board with circuit and producing method thereof

Wired circuit board and producing method thereof

Wired circuit board and connection structure between wired circuit...

Method of producing a wired circuit board

Wired circuit board

Wired circuit board and producing method thereof

Suspension board with circuit

Wired circuit board and producing method thereof

Patents Applicationslast 30 patents

SEALING SHEET

SEALING SHEET, SEALING SHEET WITH SEPARATOR, SEMICONDUCTOR DEVICE,...

PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING T...

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND CONNECT...

THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

SEALING SHEET, METHOD FOR MANUFACTURING SEALING SHEET, AND METHOD F...

WIRED CIRCUIT BOARD

SUSPENSION BOARD WITH CIRCUIT

SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFA...

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY SHEET

WIRED CIRCUIT BOARD

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

METHOD OF PRODUCING A SUSPENSION BOARD WITH CIRCUIT

SUSPENSION BOARD WITH CIRCUIT

PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND CONNECT...

WIRED CIRCUIT BOARD

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD FOR MANUFACT...

Wired circuit board and producing method thereof

PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING T...

Suspension board with circuit and producing method thereof

Wired circuit board and producing method thereof

CIRCUIT BOARD FOR BODY FLUID COLLECTION

Wired circuit board and production method thereof