Jun-Jae Wu

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Banciao City, TW

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Patents Applicationslast 30 patents

Information Patent Application
Ceramic-Copper Foil Bonding Method
- Publication number 20090152237
- Publication date Jun 18, 2009
- High Conduction Scientific Co., Ltd.
- Wen-Chung Chiang
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES