Jun Kaminaga

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device with reduced chassis thickness
- Patent number 11,281,265
- Issue date Mar 22, 2022
- Lenovo (Singapore) Pte. Ltd.
- Kenji Watamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component, electronic device, and electronic substrate
- Patent number 10,892,575
- Issue date Jan 12, 2021
- Lenovo (Singapore) Pte. Ltd.
- Hirohide Komiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND ELECTRONIC COMPONEN...
- Publication number 20210100099
- Publication date Apr 1, 2021
- LENOVO (SINGAPORE) PTE. LTD.
- Hirohide Komiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210089094
- Publication date Mar 25, 2021
- LENOVO (SINGAPORE) PTE. LTD.
- Kenji Watamura
- G06 - COMPUTING CALCULATING COUNTING