Jun Lu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having thin substrate and method of making th...
- Patent number 11,784,141
- Issue date Oct 10, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DMOS FET chip scale package and method of making the same
- Patent number 11,699,627
- Issue date Jul 11, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having thin substrate and method of making th...
- Patent number 11,495,548
- Issue date Nov 8, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having high mechanical strength
- Patent number 10,991,660
- Issue date Apr 27, 2021
- ALPHA ANC OMEGA SEMICONDUCTOR (CAYMAN) LTD.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded intelligent power module for motors
- Patent number 10,600,727
- Issue date Mar 24, 2020
- Alpha and Omega Semiconductor (Cayman) LTD
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 10,504,823
- Issue date Dec 10, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded intelligent power module and method of making the same
- Patent number 10,396,019
- Issue date Aug 27, 2019
- Alpha and Omega Semiconductor (Cayman) LTD
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Molded intelligent power module
- Patent number 10,177,080
- Issue date Jan 8, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded intelligent power module and method of making the same
- Patent number 10,141,249
- Issue date Nov 27, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Hybrid packaged lead frame based multi-chip semiconductor device wi...
- Patent number 10,043,736
- Issue date Aug 7, 2018
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package of a flipped MOSFET chip and a multi-based di...
- Patent number 9,929,076
- Issue date Mar 27, 2018
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method of a thin power device
- Patent number 9,854,686
- Issue date Dec 26, 2017
- Alpha and Omega Semiconductor (Cayman) LTD
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package device having locking mechanism, and pr...
- Patent number 9,786,583
- Issue date Oct 10, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery protection package and process of making the same
- Patent number 9,768,146
- Issue date Sep 19, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Combined packaged power semiconductor device
- Patent number 9,735,094
- Issue date Aug 15, 2017
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,685,430
- Issue date Jun 20, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,679,833
- Issue date Jun 13, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thick bottom metal and preparation method...
- Patent number 9,653,383
- Issue date May 16, 2017
- Alpha & Omega Semiconductor (Cayman), Ltd.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 9,653,424
- Issue date May 16, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 9,646,920
- Issue date May 9, 2017
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery protection package and process of making the same
- Patent number 9,564,406
- Issue date Feb 7, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer process for molded chip scale package (MCSP) with thick backs...
- Patent number 9,520,380
- Issue date Dec 13, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,472,491
- Issue date Oct 18, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined packaged power semiconductor device
- Patent number 9,437,530
- Issue date Sep 6, 2016
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side exposed semiconductor package with ultra-thin die and man...
- Patent number 9,437,528
- Issue date Sep 6, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 9,437,587
- Issue date Sep 6, 2016
- Alpha & Omega Semiconductor, Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device and preparation method thereof
- Patent number 9,431,328
- Issue date Aug 30, 2016
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of hybrid packaging a lead frame based multi-chip semiconduc...
- Patent number 9,425,181
- Issue date Aug 23, 2016
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top exposed semiconductor chip package
- Patent number 9,412,684
- Issue date Aug 9, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package device having locking mechanism, and pr...
- Patent number 9,397,029
- Issue date Jul 19, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR POWER MODULE PACKAGE HAVING LEAD FRAME ANCHORED BARS
- Publication number 20230335474
- Publication date Oct 19, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE
- Publication number 20230307325
- Publication date Sep 28, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING THIN SUBSTRATE AND METHOD OF MAKING TH...
- Publication number 20230021687
- Publication date Jan 26, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20220278009
- Publication date Sep 1, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING THIN SUBSTRATE AND METHOD OF MAKING TH...
- Publication number 20210125940
- Publication date Apr 29, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HIGH MECHANICAL STRENGTH
- Publication number 20190189569
- Publication date Jun 20, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME
- Publication number 20190067175
- Publication date Feb 28, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MOLDED INTELLIGENT POWER MODULE FOR MOTORS
- Publication number 20190006270
- Publication date Jan 3, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTELLIGENT POWER MODULE
- Publication number 20180108598
- Publication date Apr 19, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME
- Publication number 20180108601
- Publication date Apr 19, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20170186675
- Publication date Jun 29, 2017
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME
- Publication number 20170098626
- Publication date Apr 6, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME
- Publication number 20170033060
- Publication date Feb 2, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD
- Publication number 20160379918
- Publication date Dec 29, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE DEVICE HAVING LOCKING MECHANISM, AND PR...
- Publication number 20160379917
- Publication date Dec 29, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...
- Publication number 20160315039
- Publication date Oct 27, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED PACKAGED POWER SEMICONDUCTOR DEVICE
- Publication number 20160307830
- Publication date Oct 20, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING A POWER DEVICE WITH BOTTOM SOURCE ELECTRODE
- Publication number 20160155688
- Publication date Jun 2, 2016
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...
- Publication number 20160126214
- Publication date May 5, 2016
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET
- Publication number 20160104661
- Publication date Apr 14, 2016
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD THEREOF
- Publication number 20160099238
- Publication date Apr 7, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD
- Publication number 20160093560
- Publication date Mar 31, 2016
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD
- Publication number 20160093559
- Publication date Mar 31, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...
- Publication number 20160079203
- Publication date Mar 17, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20160056096
- Publication date Feb 25, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCSP POWER SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF
- Publication number 20160035653
- Publication date Feb 4, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED PACKAGED POWER SEMICONDUCTOR DEVICE
- Publication number 20150357267
- Publication date Dec 10, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20150357268
- Publication date Dec 10, 2015
- Alpha and Omega Semiconductor (Cayman), Ltd
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD THEREOF
- Publication number 20150325559
- Publication date Nov 12, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THICK BOTTOM METAL AND PREPARATION METHOD...
- Publication number 20150279766
- Publication date Oct 1, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package having thin substrate and method of making th...

DMOS FET chip scale package and method of making the same

Semiconductor package having thin substrate and method of making th...

Semiconductor package having high mechanical strength

Molded intelligent power module for motors

Power semiconductor device with small contact footprint and the pre...

Molded intelligent power module and method of making the same

Molded intelligent power module

Molded intelligent power module and method of making the same

Hybrid packaged lead frame based multi-chip semiconductor device wi...

Semiconductor package of a flipped MOSFET chip and a multi-based di...

Preparation method of a thin power device

Power semiconductor package device having locking mechanism, and pr...

Battery protection package and process of making the same

Combined packaged power semiconductor device

Embedded package and method thereof

Semiconductor package with small gate clip and assembly method

Semiconductor device with thick bottom metal and preparation method...

Semiconductor package with adhesive material pre-printed on the lea...

Power semiconductor device with small contact footprint and the pre...

Battery protection package and process of making the same

Wafer process for molded chip scale package (MCSP) with thick backs...

Semiconductor package with small gate clip and assembly method

Combined packaged power semiconductor device

Dual-side exposed semiconductor package with ultra-thin die and man...

Flip chip semiconductor device

Power device and preparation method thereof

Method of hybrid packaging a lead frame based multi-chip semiconduc...

Top exposed semiconductor chip package

Power semiconductor package device having locking mechanism, and pr...

Patents Applicationslast 30 patents

SEMICONDUCTOR POWER MODULE PACKAGE HAVING LEAD FRAME ANCHORED BARS

CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE

SEMICONDUCTOR PACKAGE HAVING THIN SUBSTRATE AND METHOD OF MAKING TH...

DMOS FET CHIP SCALE PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE HAVING THIN SUBSTRATE AND METHOD OF MAKING TH...

SEMICONDUCTOR PACKAGE HAVING HIGH MECHANICAL STRENGTH

MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME

MOLDED INTELLIGENT POWER MODULE FOR MOTORS

MOLDED INTELLIGENT POWER MODULE

MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME

BATTERY PROTECTION PACKAGE AND PROCESS OF MAKING THE SAME

SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD

POWER SEMICONDUCTOR PACKAGE DEVICE HAVING LOCKING MECHANISM, AND PR...

Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device wi...

COMBINED PACKAGED POWER SEMICONDUCTOR DEVICE

METHOD FOR PACKAGING A POWER DEVICE WITH BOTTOM SOURCE ELECTRODE

SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...

A SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET

EMBEDDED PACKAGE AND METHOD THEREOF

POWER SEMICONDUCTOR DEVICE AND THE PREPARATION METHOD

SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD

WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...

POWER SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF

MCSP POWER SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF

COMBINED PACKAGED POWER SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

EMBEDDED PACKAGE AND METHOD THEREOF

SEMICONDUCTOR DEVICE WITH THICK BOTTOM METAL AND PREPARATION METHOD...