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Jun MATSUEDA

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  • Kawasaki, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of encapsulating an electronic component
    • Patent number 8,065,793
    • Issue date Nov 29, 2011
    • Fujitsu Limited
    • Kazuyuki Ikura
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Ultrasonic bonding apparatus
    • Patent number 7,938,160
    • Issue date May 10, 2011
    • Fujitsu Limited
    • Yasuyuki Masuda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ultrasonic bonding apparatus
    • Patent number 7,905,268
    • Issue date Mar 15, 2011
    • Fujitsu Limited
    • Yasuyuki Masuda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic bonding apparatus
    • Patent number 7,823,618
    • Issue date Nov 2, 2010
    • Fujitsu Limited
    • Yasuyuki Masuda
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents