Jun Ming Hu

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Canton, MI, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for making an electronic circuit assembly
- Patent number 6,381,837
- Issue date May 7, 2002
- Visteon Global Technologies, Inc.
- Jay DeAvis Baker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic encapsulated IC package and method of designing same
- Patent number 6,187,601
- Issue date Feb 13, 2001
- Ford Global Technologies, Inc.
- Jun Min Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standoff controlled interconnection
- Patent number 5,931,371
- Issue date Aug 3, 1999
- Ford Motor Company
- Yi-Hsin Pao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic encapsulated IC package and method of designing same
- Patent number 5,773,877
- Issue date Jun 30, 1998
- Ford Motor Company
- Jun Min Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for making an electronic circuit assembly
- Publication number 20020000331
- Publication date Jan 3, 2002
- Vivek Amir Jairazbhoy
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...