Jun Monma

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Kanagawa-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a tab chip on a tape carrier with lead...
- Patent number 5,969,413
- Issue date Oct 19, 1999
- Kabushiki Kaishi Toshiba
- Keiichi Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride wiring substrate and method for production thereof
- Patent number 5,928,769
- Issue date Jul 27, 1999
- Kabushiki Kaisha Toshiba
- Jun Monma
- B32 - LAYERED PRODUCTS
Information Patent Grant
Aluminum nitride wiring substrate
- Patent number 5,804,288
- Issue date Sep 8, 1998
- Kabushiki Kaisha Toshiba
- Jun Monma
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Sintered aluminum nitride and circuit substrate using sintered alum...
- Patent number 5,641,718
- Issue date Jun 24, 1997
- Kabushiki Kaisha Toshiba
- Akihiro Horiguchi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Circuit substrate including insulating layer of aluminum nitride an...
- Patent number 5,616,956
- Issue date Apr 1, 1997
- Kabushiki Kaisha Toshiba
- Akihiro Horiguchi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES