Jun Nogawa

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding method and bonding apparatus
- Patent number 7,370,786
- Issue date May 13, 2008
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding apparatus
- Patent number 6,932,262
- Issue date Aug 23, 2005
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device and wire bonding method
- Patent number 6,786,392
- Issue date Sep 7, 2004
- NEC Electronics Corporation
- Jun Nogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device
- Patent number 6,669,076
- Issue date Dec 30, 2003
- NEC Electronics Corporation
- Jun Nogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bonding method and bonding apparatus
- Publication number 20060011706
- Publication date Jan 19, 2006
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding method and bonding apparatus
- Publication number 20040214406
- Publication date Oct 28, 2004
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding device and wire bonding method
- Publication number 20030098333
- Publication date May 29, 2003
- NEC Corporation
- Jun Nogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding device
- Publication number 20020104870
- Publication date Aug 8, 2002
- NEC Corporation
- Jun Nogawa
- H01 - BASIC ELECTRIC ELEMENTS